유연/신축성 전자패키징 용 폴리머 재료의 기계적 물성 측정 기술 리뷰Measurement Technologies of Mechanical Properties of Polymers used for Flexible and Stretchable Electronic Packaging
- Publisher
- 한국마이크로전자및패키징학회
- Issue Date
- 2016-06
- Language
- Korean
- Citation
마이크로전자 및 패키징학회지, v.23, no.2, pp.19 - 28
- ISSN
- 1226-9360
- Appears in Collection
- ME-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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