Current Status and Forecast on Development of Metal Matrix Composites for Electronic Packaging Applications

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Publisher
2nd Symposium on Composite Materials in Korean Institute of Metals and Materials
Issue Date
2001-10-26
Language
Korean
Citation

2nd Symposium on Composite Materials in Korean Institute of Metals and Materials

URI
http://hdl.handle.net/10203/213472
Appears in Collection
MS-Conference Papers(학술회의논문)
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