An apparatus for performing microtensile tests at elevated temperatures inside a scanning electron microscope

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In this paper, we introduce an apparatus to perform microtensile tests at elevated temperatures inside a scanning electron microscope. The apparatus has a stroke of 250 pm with a displacement resolution of 10 nm and a load resolution of 9.7 mu N. Measurements at elevated temperatures are performed through use of two silicon-based micromachined heaters that support the sample. Each heater consists of a tungsten heating element that also serves as a temperature gauge. To demonstrate the testing capabilities, tensile tests were performed on submicron Cu films at various temperatures up to 430 degrees C. Stress-strain curves show a significant decrease in yield strength and initial slope for the samples tested at elevated temperature, which we attribute to diffusion-facilitated grain boundary sliding and dislocation climb.
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Issue Date
2013-11
Language
English
Article Type
Article
Keywords

FREESTANDING THIN-FILMS; COPPER-FILMS; MECHANICAL-PROPERTIES; GRAIN-BOUNDARY; FATIGUE BEHAVIOR; LENGTH-SCALE; CU FILMS; SIZE; PLASTICITY; TENSILE

Citation

ACTA MATERIALIA, v.61, no.19, pp.7500 - 7510

ISSN
1359-6454
DOI
10.1016/j.actamat.2013.08.064
URI
http://hdl.handle.net/10203/209575
Appears in Collection
ME-Journal Papers(저널논문)
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