Measurement of Hygroscopic Properties and Prediction of Moisture-Induced Warpage for Flexible Packaging Substrates

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Publisher
Microjoining and Packaging Committee
Issue Date
2015-09-18
Language
Korean
Citation

Microjoining and Packaging Committee (MPC) 2015 Autumn Symposium

URI
http://hdl.handle.net/10203/204775
Appears in Collection
ME-Conference Papers(학술회의논문)
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