Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications

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This paper presents near-field (NF) and far-field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in packages and boards. Three test vehicles have been designed and fabricated for NF and FF measurements. Simulation results using a full-wave solver (SONNET) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure based power distribution network for noise isolation and suppression in mixed-signal systems.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2007-05
Language
English
Article Type
Article; Proceedings Paper
Keywords

NOISE

Citation

IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.2, pp.180 - 190

ISSN
1521-3323
DOI
10.1109/TADVP.2007.896921
URI
http://hdl.handle.net/10203/20465
Appears in Collection
EE-Journal Papers(저널논문)
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