Magnetically-Coupled Current Probing Structure Consisting of TSVs and RDLs in 2.5D and 3D Ics

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Publisher
IEEE International 3D Systems Integration Conference
Issue Date
2014-12-01
Language
English
Citation

IEEE International 3D Systems Integration Conference

URI
http://hdl.handle.net/10203/203472
Appears in Collection
EE-Conference Papers(학술회의논문)
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