학위논문(석사) - 한국과학기술원 : 기계공학전공, 2015.2 ,[ⅶ, 50p :]
warpage; package substrate; copper clad laminate; glass fiber reinforced polymer; thin FR4; flexural modulus; coefficient of thermal expansion; digital image correlation; warpage orientation; 휨; 패키지 기판; CCL; GFRP; 박형 FR4; 굽힘 탄성계수; 열팽창계수; 디지털이미지연관법; 휨 방향
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