DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Sukjin | ko |
dc.contributor.author | Jung, Daniel Hyunsuk | ko |
dc.contributor.author | Kim, Jonghoon J. | ko |
dc.contributor.author | Bae, Bumhee | ko |
dc.contributor.author | Kong, Sunkyu | ko |
dc.contributor.author | Ahn, Seungyoung | ko |
dc.contributor.author | Kim, Jonghoon | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2015-11-20T07:26:12Z | - |
dc.date.available | 2015-11-20T07:26:12Z | - |
dc.date.created | 2015-08-25 | - |
dc.date.created | 2015-08-25 | - |
dc.date.created | 2015-08-25 | - |
dc.date.issued | 2015-07 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.7, pp.863 - 878 | - |
dc.identifier.issn | 2156-3950 | - |
dc.identifier.uri | http://hdl.handle.net/10203/200667 | - |
dc.description.abstract | As technology develops, the number of chips increases while the thickness of mobile products continuously decreases, which leads to the need for high-density packaging techniques with high numbers of power and signal lines. By applying wireless power transfer technology at the printed circuit board (PCB) and package levels, the number of power pins can be greatly reduced to produce more space for signal pins and other components in the system. For the first time, in this paper, we propose and demonstrate a high-efficiency PCB- and package-level wireless power transfer interconnection scheme. We enhance the efficiency by applying magnetic field resonance coupling using a matching capacitor. The proposed scheme can replace a high number of power interconnections with rectangular spiral coils to wirelessly transfer power from the source to the receiver at the PCB and package levels. The equivalent circuit model is suggested with analytic equations, which is then analyzed to optimize the test vehicle design. For the experimental verification of the suggested model, the Z-parameter results obtained from the model-based equation and measurement of the designed and fabricated test vehicles are compared at up to 1 GHz. The power transfer efficiency from the source coil to the receiver coil in this scheme is able to reach 85.6%. Finally, we designed and fabricated a CMOS full-bridge rectifier and mounted it on the receiver board to convert the transferred voltage from ac voltage to dc voltage. A measured dc voltage of 2.0 V is sufficient to operate the circuit, which generally consists of 1.5 V devices. | - |
dc.language | English | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.subject | MUTUAL IMPEDANCES | - |
dc.subject | INDUCTORS | - |
dc.subject | NETWORKS | - |
dc.subject | CIRCUIT | - |
dc.subject | DESIGN | - |
dc.subject | SELF | - |
dc.title | High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling | - |
dc.type | Article | - |
dc.identifier.wosid | 000358494900001 | - |
dc.identifier.scopusid | 2-s2.0-85027945460 | - |
dc.type.rims | ART | - |
dc.citation.volume | 5 | - |
dc.citation.issue | 7 | - |
dc.citation.beginningpage | 863 | - |
dc.citation.endingpage | 878 | - |
dc.citation.publicationname | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | - |
dc.identifier.doi | 10.1109/TCPMT.2015.2446613 | - |
dc.contributor.localauthor | Ahn, Seungyoung | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Kim, Jonghoon J. | - |
dc.contributor.nonIdAuthor | Kim, Jonghoon | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | CMOS full-bridge rectifier | - |
dc.subject.keywordAuthor | ferrite | - |
dc.subject.keywordAuthor | high efficiency | - |
dc.subject.keywordAuthor | low turn-ON voltage | - |
dc.subject.keywordAuthor | magnetic field resonance coupling | - |
dc.subject.keywordAuthor | package | - |
dc.subject.keywordAuthor | power transfer efficiency | - |
dc.subject.keywordAuthor | printed circuit board (PCB) | - |
dc.subject.keywordAuthor | voltage transfer ratio | - |
dc.subject.keywordAuthor | wireless power transfer | - |
dc.subject.keywordPlus | MUTUAL IMPEDANCES | - |
dc.subject.keywordPlus | INDUCTORS | - |
dc.subject.keywordPlus | NETWORKS | - |
dc.subject.keywordPlus | CIRCUIT | - |
dc.subject.keywordPlus | DESIGN | - |
dc.subject.keywordPlus | SELF | - |
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