Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference

Showing results 18101 to 18120 of 22767

18101
Throughput analysis of IEEE 802.11e wireless LANs and efficient Block Ack mechanism

Lee I.-G.; Yoon S.-R.; Park, Sin Chong, IEEE International Symposium on Communications and Information Technologies: Smart Info-Media Systems, ISCIT 2004, v.1, pp.290 - 295, 2004-10-26

18102
Throughput and Delay performance of Dynamic Spectrum Management over DSL Arrivals

Yi, Yung; Tsiaflakis, Paschalis; Chiang, Mung; Moonen, Marc, IEEE Globecom, IEEE, 2008-11

18103
Throughput Comparisons of Single- and Two-Hop Celluar Systems with Single or Multiple Antennas

Sung, Dan Keun; Yoon, S.H.; Baek, S.Y.; Ban, T.W., JCCI 2009, 2009-04

18104
Throughput enhancement for short packets in the wireless packet networks

Kwon, Y.-H.; Oh, M.-K.; Park, Dong-Jo, 2004 7th International Conference on Signal Processing Proceedings (ICSP'04), v.3, pp.1833 - 1836, 2004-08-31

18105
Throughput Enhancement of IEEE 802.11 MAC by antenna selection for IEEE 802.11a devices

Lee J.-H.; Lee S.; Park, Sin Chong, 9th International Conference on Advanced Communication Technology, ICACT 2007, v.3, pp.1732 - 1733, 2007-02-12

18106
Throughput Enhancement of Secondary Transmitter under Target Physical Layer Security Rate

Koh, Jeongwan; Myung, Jungho; Kang, Joonhyuk, 24th Annual IEEE International Symposium on Personal, Indoor and Mobile Radio Communications, pp.513 - 517, IEEE, 2013-09-09

18107
Throughput enhancement through arranged power-saving mechanism in wireless LAN

Hyu-dae Kim; Cho, Dong-Ho, 2006 IEEE International Conference on Communications, ICC 2006, pp.4780 - 4785, IEEE, 2006-07-11

18108
Throughput improvement for wireless multihop networks with LRED

Jeon, J.-H.; Choi, H.-S.; Lim, Jong-Tae, International Conference on Control, Automation and Systems, ICCAS 2007, pp.2601 - 2605, 2007-10-17

18109
Throughput of Random Access Without Message Passing

Yi, Yung; Proutiere, Alexandre; Chiang, Mung, 42nd Annual Conference on Information Sciences and Systems, pp.509 - 514, IEEE, 2008

18110
Throughput of the 1x EV-DO System with Various Scheduling Algorithms

Choi, Eun Ho; Choi, Wan; Andrews, Jeffrey, IEEE International Symposium on Spread Spectrum Techniques and Applications (ISSSTA), pp.359 - 363, IEEE, 2004-08-30

18111
Throughput Scaling of Covert Communication over Wireless Adhoc Networks

Cho, Kang-Hee; Lee, Si-Hyeon; Tan, Vincent Y. F., 2019 IEEE International Symposium on Information Theory, ISIT 2019, pp.2164 - 2168, Institute of Electrical and Electronics Engineers Inc., 2019-07-11

18112
Throughput, Energy Consumption, and Energy Efficiency of IEEE 802.15.6 Body Area Network (BAN) MAC Protocol

Jung, BH; Usman, A; Sung, Dan Keun, IEEE PIMRC 2012, IEEE, 2012-09

18113
Throughput-delay and stability analysis of an asynchronous spread spectrum packet radio network

Lim, Dong-Min; Lee, Hwang Soo, INFOCOM'91, v.3, pp.11401 - 11410, INFOCOM, 1991-04-07

18114
Throughput-effective on-chip networks for manycore accelerators

Bakhoda A.; Kim, John Dongjun; Aamodt T.M., 43rd Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2010, v.0, no.0, pp.421 - 432, IEEE Computer Society, 2010-12-04

18115
THz 통신 시스템에 대한 비트오류율(Bit error rate) 측정

강광용; 백문철; 하재권; 강진섭; 양경훈, 한국전자파학회 하계종합학술대회, pp.1 - 1, 한국전자파학회, 2019-08-23

18116
THzID: A 1.6mm2 Package-Less Cryptographic Identification Tag with Backscattering and Beam-Steering at 260GHz

Ibrahim, Mohamed I.; Khan, Muhammad Ibrahim Wasiq; Juvekar, Chiraag S.; Jung, Wanyeong; Yazicigil, Rabia Tugce; Chandrakasan, Anantha P.; Han, Ruonan, IEEE International Solid-State Circuits Conference, ISSCC 2020, pp.454 - 455, Institute of Electrical and Electronics Engineers (IEEE), 2020-02-19

18117
Ti Thickness Effects in Pt/Ti Bottom Electrode on Properties of (Ba, Sr)TiO3 Thin Film

Lee, Hee Chul, pp.0 - 0, 1996-03-01

18118
TiBroco: A fast and secure distributed learning framework for tiered wireless edge networks

Han, Dong-Jun; Sohn, Jy-yong; Moon, Jaekyun, 40th IEEE Conference on Computer Communications, INFOCOM 2021, Institute of Electrical and Electronics Engineers Inc., 2021-05

18119
TID and SEE hardened n-MOSFET layout on a bulk silicon substrate which combines a DGA n-MOSFET and a guard drain

Roh, Young Tak; Lee, Hee Chul, 2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015, Institute of Electrical and Electronics Engineers Inc., 2015-11-02

18120
TID Effect on 12-bit 100kSPS SAR ADC Designed with DGA n-MOSFET

Kim, Tae Hyo; Lee, Hee Chul, ISOCC (International SoC Design Conference) 2015, ISOCC, 2015-11-03

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