Browse "School of Electrical Engineering(전기및전자공학부)" by Title

Showing results 17401 to 17420 of 43416

17401
High-Efficiency Two-Inductor PFC Boost Converter Employing SPDT Relay

Kim, Chong-Eun; Yang, Deok-Ki; Lee, Jae-Bum; Moon, Gun-Wooresearcher, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.30, no.6, pp.2901 - 2904, 2015-06

17402
High-Efficient Multilevel Half-Bridge Converter

Cho, In-Ho; Yi, Kang-Hyun; Cho, Kyu-Min; Moon, Gun-Wooresearcher, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.25, pp.943 - 951, 2010-04

17403
High-fidelity and high-efficiency analog amplifier combined with digital amplifier

조규형researcher, 2002-05-28

17404
High-Fidelity Depth Upsampling Using the Self-Learning Framework

Shim, Inwook; Oh, Tae-Hyun; Kweon, In Soresearcher, SENSORS, v.19, no.1, 2019-01

17405
HIGH-FIELD BREAKDOWN IN THIN OXIDES GROWN IN N2O AMBIENT

JOSHI, AB; Yoon, Giwanresearcher; KIM, JH; LO, GQ; KWONG, DL, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.40, no.8, pp.1437 - 1445, 1993-08

17406
High-field magnetic resonance techniques for brain research

Kim, Dae-Shikresearcher; Garwood, M, CURRENT OPINION IN NEUROBIOLOGY, v.13, no.5, pp.612 - 619, 2003-10

17407
HIGH-FIELD-INDUCED LEAKAGE IN ULTRATHIN N2O OXIDES

Yoon, Giwanresearcher; JOSHI, AB; KIM, J; KWONG, DL, IEEE ELECTRON DEVICE LETTERS, v.14, no.5, pp.231 - 233, 1993-05

17408
High-finesse AlxOy/AlGaAs nonabsorbing optical cavity

Shin, HE; Ju, YG; Song, HW; Song, DS; Han, IY; Ser, JH; Ryu, HY; et al, APPLIED PHYSICS LETTERS, v.72, no.18, pp.2205 - 2207, 1998-05

17409
High-frequency Displacement Monitoring Robot System Using Sensor Fusion of a Visually Servoed Paired Structured Light System with an Inertial Measurement Unit

Jeon, Haemin; Kim, Youngjae; Myung, Hyunresearcher, ICCES 2014 (Int'l Conf. on Computational & Experimental Engineering and Sciences), ICCES'14 Organizing Committee, 2014-06-13

17410
High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test

Park, Junyong; Kim, Hyesoo; Kim, Jonghoon J.; Kim, DongHyun; Son, Kyungjune; Kim, Subin; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.12, pp.2152 - 2162, 2018-12

17411
High-frequency Electrical Model of Chip-to-Chip Via Interconnection for 3-D Chip Stacking Package

Kim, Jounghoresearcher; Ryu, Chunghyun; Chung, Daehyun; Lee, Junho; Lee, Kwangyong; Oh, Taesung, IEEE 14th(13) Topical Meeting on Electrical Performance of Electronic Packaging, pp.151 - 154, IEEE, 2005-10

17412
High-frequency electrical performance of a new high-density Multiple Line Grid Array (MLGA) package

Ahn, Seungyoung; Lee, Joon-Woo; Kim, Jonghoon; Ryu, Woongwhan; Kim, Young-Soo; Yoon, Chong K.; Kim, Jounghoresearcher, 50th Electronic Components and Technology Conference, pp.497 - 501, 2000

17413
High-frequency Measurements of TSV failures

Kim, Joohee; Cho, Jonghyun; Pak, Jun So; Kim, Jounghoresearcher; Yook, Jong-Min; Kim, Jun Chul, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29

17414
High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package

Kim, Hyesoo; Kim, Jonghoon J.; Park, Junyong; Park, Shinyoung; Choi, Sumin; Bae, Bumhee; Ha, DongHo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1356 - 1368, 2017-08

17415
High-frequency on-chip inductance model

Sim, SP; Lee, Kwyroresearcher; Yang, CY, IEEE ELECTRON DEVICE LETTERS, v.23, no.12, pp.740 - 742, 2002-12

17416
High-Frequency Performance of GaAs Floated Electron Channer FET(FECFET)

Kwon, Young Seresearcher, International Conference on VLSI and CAD, 1993

17417
HIGH-FREQUENCY RESONANT AC/DC RECTIFIER WITH UNITY POWER-FACTOR

CHOI, HC; HAN, JW; Youn, Myung Joongresearcher, ELECTRONICS LETTERS, v.28, no.17, pp.1592 - 1594, 1992-08

17418
High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Kim, Joo-Hee; Pak, Jun-So; Cho, Jong-Hyun; Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Hee-Gon; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.181 - 195, 2011-02

17419
High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via

Kim, Joo-Hee; Cho, Jong-Hyun; Kim, Jounghoresearcher; Yook, Jong-Min; Kim, Jun Chul; Lee, Junho; Park, Kunwoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.4, pp.697 - 707, 2014-04

17420
High-frequency scalable modeling of a through silicon via (TSV) and proposal of a failure detection method of 3D ICs = 3차원 집적회로에서 TSV의 고주파 모델링 및 TSV 불량 검출 방법에 관한 연구link

Kim, Joo-Hee; 김주희; et al, 한국과학기술원, 2013

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