Browse "School of Electrical Engineering(전기및전자공학부)" by Title

Showing results 14781 to 14800 of 42677

14781
Extremely scaled silicon nano-CMOS devices

Chang, LL; Choi, Yang-Kyuresearcher; Ha, DW; Ranade, P; Xiong, SY; Bokor, J; Hu, CM; et al, PROCEEDINGS OF THE IEEE, v.91, no.11, pp.1860 - 1873, 2003-11

14782
Extremely transparent and conductive ZnO:Al thin films prepared by photo-assisted metalorganic chemical vapor deposition (photo-MOCVD) using AlCl3(6H(2)O) as new doping material

Myong, SY; Baik, SJ; Lee, CH; Cho, WY; Lim, Koeng Suresearcher, JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, v.36, pp.L1078 - L1081, 1997

14783
Extrinsic Calibration between a 3D Laser SCanner and a Camera using PCA method

Park, Sang Un; Chung, Myung Jinresearcher, The 9th International Conference on Ubiquitous Robots and Ambient Intelligence, KROS, 2012-11

14784
Extrinsic Calibration of 2-D Lidars Using Two Orthogonal Planes

Choi, Dong-Geol; Bok, Yunsu; Kim, Jun-Sik; Kweon, In Soresearcher, IEEE TRANSACTIONS ON ROBOTICS, v.32, no.1, pp.83 - 98, 2016-02

14785
Extrinsic Calibration of 2D Laser Sensors

Kweon, In-Soresearcher; Choi, Dong-Geol; Bok, Yunsu; Kim, Junsik, International Conference on Robotics & Automation (ICRA2014), IEEE Robotics and Automation Society, 2014-06-03

14786
Extrinsic calibration of a camera and a 2D laser without overlap

Bok, Yunsu; Choi, Dong-Geol; Kweon, In-Soresearcher, ROBOTICS AND AUTONOMOUS SYSTEMS, v.78, pp.17 - 28, 2016-04

14787
Extrinsic Calibration of Non-overlapping Camera-Laser System using Structured Environment

Bok, Yunsu; Kweon, In-Soresearcher; Choi, Dong-Geol; Pascal Vasseur, IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS2014), IEEE Robotics and Automation Society (RAS), 2014-09-15

14788
Extrinsic information memory reduced architecture for non-binary turbo decoder implementation

Park, S.M.; Kwak, J.; Lee, Kwyroresearcher, 2008 IEEE 67th Vehicular Technology Conference-Spring, VTC, pp.539 - 543, 2008-05-11

14789
EXTRINSIC VERSUS INTRINSIC MODELS FOR FETS

YTTERDAL, T; FJELDLY, TA; Lee, Kwyroresearcher, PHYSICA SCRIPTA, v.54, pp.139 - 140, 1994

14790
Eye diagram estimation including crosstalk effect for high-speed channel on PCB, silicon and glass interposer = 인쇄 회로 기판, 실리콘과 유리 인터포저의 고속 채널을 위한 누화 효과 포함 아이 다이어그램 예측link

Choi, Su-Min; 최수민; et al, 한국과학기술원, 2014

14791
Eye Diagram Estimation of 8B/10B Encoded Highspeed Serial Link for Signal Integrity Test using Silicone Rubber Socket

Park, Junyong; Kim, Jounghoresearcher; Kim, Jonghoon J; Kim, Heegon; Bae, Michael; Ha, Dongho, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27

14792
Eye Diagram Estimation on Silicone Rubber Socket

Park, Jun Yong; Kim, Hye Soo; Kim, Jong Hoon; Bae, Bum Hee; Ha, Dong Ho; Bae, Micahel; Kim, Joung Horesearcher, 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 2015-11-23

14793
Eye Mouse System for the Disabled

Chung, Myung Jinresearcher; Kim, J.H.; Lee, Y.J.; Chu, G.W.; Yoo, D.H.; Kim, D.H., 2000 Service Robot Workshop, pp.145 - 152, 2000-07

14794
Eye Mouse System using Eye-Gaze Direction

Kim, Do Hyung; Kim, Jae Heon; Chung, Myung Jinresearcher, KIEE,IEEK,ICASE Joint Spring Conference on Control and Robotics, pp.13 - 16, 2000-03

14795
Eye-diagram Estimation and Analysis of High-Bandwidth Memory (HBM) Interposer Channel with Crosstalk Reduction Schemes on 2.5D and 3D IC

Choi, Sumin; Kim, Jounghoresearcher; Kim, Heegon; Kim, Jonghoon J; Lim, Jaemin; Lee, Hyunsuk; Cho, Kyungjun, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27

14796
Eye-diagram estimation based on fourier-series signal decomposition technique in high-speed interconnects = 고속 신호선에서의 푸리에급수 신호 분해 기법 기반의 아이다이어그램 예측link

Cho, Jeong-Hyeon; 조정현; et al, 한국과학기술원, 2011

14797
Eye-diagram estimation method for high-speed interconnect in through-silicon via (TSV) based three-dimensional IC (3-D IC) = 실리콘 관통 비아 기반 3차원 IC의 고속 채널을 위한 아이-다이어그램 예측 방법link

Kim, Hee-Gon; 김희곤; et al, 한국과학기술원, 2011

14798
Eye-diagram estimation method for high-speed interconnect in through-silicon via (TSV) based three-dimensional IC (3-D IC) = 실리콘 관통 비아 기반 3차원 IC의 고속 채널을 위한 아이-다이어그램 예측 방법link

Kim, Hee-Gon; 김희곤; et al, 한국과학기술원, 2011

14799
Eye-Diagram Estimation Methods for Voltage- and Probability-dependent PAM4 Signal on Stacked on Through-Silicon Vias (TSVs)

Kim, Jounghoresearcher; Park, Junyong; Kim, Jonghoon; Choi, Sumin; Kim, Youngwoo; Kim, Heegon, Electronic Components and Technology Conference 2017, Electronic Components and Technology Conference 2017, 2017-05-30

14800
Eye-diagram Estimation using Equivalent Circuit Model of Coupled Microstrip Channel on High-speed and Wide I/O Channel for 2.5D and 3D IC

Kim, Jounghoresearcher; Choi, Sumin; Kim, Heegon; Jung, Daniel H; Kim, Jonghoon J; Lim, Jaemin; Lee, Hyunsuk; et al, IEEE Workshop on Signal and Power Integrity, IEEE Workshop on Signal and Power Integrity, 2016-05-08

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