Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 38981 to 39000 of 51622
| Versatile Transfer of an Ultralong and Seamless Nanowire Array Crystallized at High Temperature for Use in High-Performance Flexible Devices Seo, Min-Ho; Yoo, Jae-Young; Choi, So-Young; Lee, Jae Shin; Choi, Kwang-Wook; Jeong, Chang Kyu; Lee, Keon Jae; et al, ACS NANO, v.11, no.2, pp.1520 - 1529, 2017-02 |
| Versatile use of ZnO interlayer in hybrid solar cells for self-powered near infra-red photo-detecting application Kim, Jun Young; Vincent, Premkumar; Jang, Jaewon; Jang, Min Seok; Choi, Muhan; Bae, Jin-Hyuk; Lee, Changhee; et al, JOURNAL OF ALLOYS AND COMPOUNDS, v.813, 2020-01 |
| Versatile video on demand system Kim, C.S.; Kim, D.Y.; Bae, T.M.; Ro, YongMan, 9th International Symposium on Consumer Electronics 2005, ISCE 2005, pp.441 - 444, 2005-06-14 |
| Vertex adjustment method using geometric constraint for polygon-based shape coding Yun, BJ; Lee, SW; Kim, Seong-Dae, ELECTRONICS LETTERS, v.37, no.12, pp.754 - 755, 2001-06 |
| Vertex cache of programmable geometry processor for mobile multimedia application Chung, K.; Yu, C.-H.; Kim, Lee-Sup, ISCAS 2006: 2006 IEEE International Symposium on Circuits and Systems, pp.1908 - 1911, IEEE, 2006-05-21 |
| Vertex Locations Representation by Block-Runlength Coding Kim, Jae Kyoon, Picture Coding Symposium (PCS) 2001, 2001 |
| Vertex merging algorithm for extracting a variable-resolution isosurface from volume data Oh, Kwang Man; Park, Kyu Ho, Proceedings of the 1995 IEEE International Conference on Systems, Man and Cybernetics. Part 2 (of 5), v.4, pp.3543 - 3548, 1995-10-22 |
| Vertical digital thermooptic switch in polymer Kwon, MS; Shin, Sang Yung; Choi, DS; Kim, KH, IEEE PHOTONICS TECHNOLOGY LETTERS, v.16, no.3, pp.783 - 785, 2004-03 |
| Vertical electromagnetic bandgap structure for noise suppression in single-ended and differential signaling on a multi-layer backplane board Hwang, C; Jongbae P.; Jaemin K.; Kyoungchoul K.; Kim, Joungho, 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009, pp.197 - 200, IEEE, 2009-01-12 |
| Vertical FET fabrication for optoelectronic integrated circuit = 광전 집적 회로를 위한 수직형 전계 효과 트랜지스터의 제작link Kim, Chang-Tae; 김창태; et al, 한국과학기술원, 1990 |
| Vertical Graphene Field-Effect Transistor using Direct Growth Graphene Nanoribbon 홍슬기; 봉재훈; 황완식; 조병진, The 2nd Korean Graphene Symposium, 한국그래핀연구회, 2015-03-26 |
| Vertical Inductive Bridge EBG (VIB-EBG) Structure With Size Reduction and Stopband Enhancement for Wideband SSN Suppression Kim, Myung-Hoi; Koo, Kyoung-Choul; Kim, Joung-Ho; Kim, Ji-Seong, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.22, no.8, pp.403 - 405, 2012-08 |
| Vertical InGaAs Biristor for Sub-1 V Operation Kim, Wu-Kang; Bidenko, Pavlo; Kim, Jongmin; Sim, Jaeho; Han, Joon-Kyu; Kim, Seongkwang; Geum, Dae-Myeong; et al, IEEE ELECTRON DEVICE LETTERS, v.42, no.5, pp.681 - 683, 2021-05 |
| Vertical integration of an LED and a vertical transistor using selective MOCVD Hong Chang-Hee; Kim Chang-Tae; Kwon, Young Se, 22nd International Conference on Solid State Devices and Materials, pp.529 - 532, 1990-08-22 |
| VERTICAL INTEGRATION OF GAAS/ALGAAS LASER DIODE AND VERTICAL JFET Yoo, Hoi-Jun; Kwon, Young Se, JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, v.27, no.3, pp.431 - 433, 1988-03 |
| VERTICAL INTEGRATION OF LASER DIODE AND TRANSISTOR. Yoo Hoi-Jun; Kwon, Young Se, Proceedings - TENCON 87: 1987 IEEE Region 10 Conference, 'Computers and Communications Technology Toward 2000'., pp.1241 - 1243, 1987 |
| Vertical micromirror fabricated in (110) silicon device layer by combination of KOH and DRIE etch Yu, Kyoungsik; Lee, D.; Solgaard, O., Lasers and Electro-Optics Society, 2004. LEOS 2004. The 17th Annual Meeting of the IEEE, v.2, pp.531 - 532, IEEE/LEOS International Conference on Optical MEMS, 2004-11-07 |
| Vertical Mirror Fabrication Combining KOH Etch and DRIE of (110) Silicon Lee, D; Yu, Kyoungsik; Krishnamoorthy, U; Solgaard, O, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.18, no.1, pp.217 - 227, 2009-02 |
| Vertical multi-stacked electromagnetic bandgap structure for power/ground noise isolation in the multi-layer package and printed circuit board = 다층 패키지 및 PCB에서의 전력/접지 잡음 억제를 위한 수직의 다층 적층 EBG 구조link Yoo, Jeong-Sik; 유정식; et al, 한국과학기술원, 2009 |
| Vertical Noise Coupling From On-Chip Switching-Mode Power Supply in a Mixed-Signal Stacked 3-D-IC Koo, Kyoung-Choul; Kim, Myung-Hoi; Kim, Jonghoon J.; Kim, Joung-Ho; Kim, Ji-Seong, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.3, pp.476 - 488, 2013-03 |
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