Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 27201 to 27220 of 50972
| Noise analysis of a wavelength-locked Fabry-Perot laser diode Park, K.-Y.; Lee, Chang-Hee, 2008 7th International Conference on the Optical Internet, COIN 2008, pp.1 - 2, 2008-10-14 |
Noise analysis of replica driving technique and its verification to 12-bit 200 MS/s pipelined ADC Lee, Chang-Kyo; Ryu, Seung-Tak, IET CIRCUITS DEVICES & SYSTEMS, v.13, no.8, pp.1277 - 1283, 2019-11 |
| Noise and Gain Optimization Technique for RF Integrated CMOS Low Noise Amplifier Lee, Sang-Gug, IEEE International Conference on Electronic Devices and Solid-State Circuits, v.0, no.0, pp.221 - 224, IEEE International Conference on Electronic Devices and Solid-State Circuits, 2003-12-01 |
| Noise and Interference Characterization for MLC Flash Memories Moon, Jaekyun; No, J.; Lee, S.; Kim, S.; Yang, J.; Chang, S., International Conference on Computing, Networking and Communications 2012, IEEE, 2012-01-30 |
| Noise aware depth denoising for a time-of-flight camera Kweon, In-So; Jung, Jiyoung; Lee, Joon Young, 20th Korea-Japan Joint Workshop on Frontiers of Computer Vision, Asian Federation of Computer Vision (AFCV), 2014-02-05 |
| Noise bandwidth suppression circuit for low noise IRFPA Kim, B.; Kang, S.-G.; Lee, Hee Chul; Kim, C.-K., Infrared Technology and Applications XXVIII, v.4820, no.1, pp.327 - 333, 2002-07-07 |
| Noise bandwidth suppression for low noise readout circuit Kim, B; Lee, Hee Chul, ELECTRONICS LETTERS, v.38, no.12, pp.558 - 560, 2002-06 |
| Noise cancelling with autoassociative memory trained by order statistics Bae, J; Ryu, Y; Song, Iickho, Proceedings of the 1994 IEEE International Conference on Neural Networks. Part 1 (of 7), v.5, pp.3431 - 3436, 1994-06-27 |
| Noise Capacitive Sensor for Multi-Touch Mobile Handset's Applications Ko, S.; Shin, H.; Lee, J.; Jang, H.; So, B.-C.; Yun, I.; Lee, Kwyro, IEEE ASIAN SOLID-STATE CIRCUITS CONF., pp.113 - 116, IEEE, 2009-12 |
| Noise Characteristics of a Wavelength-Locked Fabry-Perot Laser Diode Park, Kun-Youl; Lee, Chang-Hee, IEEE JOURNAL OF QUANTUM ELECTRONICS, v.44, no.11-12, pp.995 - 1002, 2008 |
| Noise coupling analysis and reduction in 3D-IC considering through-silicon via (TSV) nonlinearity = 3차원 집적회로에서 TSV의 비선형성을 고려한 노이즈 커플링 분석 및 감소에 관한 연구link Cho, Jong-Hyun; 조종현; et al, 한국과학기술원, 2013 |
| Noise Coupling Analysis between TSV and Active Circuit Kim, Joungho; Jonghyun Cho, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10 |
| Noise coupling analysis method for an electronic safety and arming device (ESAD) Kang, Hyungmin; Kim, Subin; Lho, Daehwan; Park, Hyunwook; Sim, Boogyo; Kim, Joungho, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Noise coupling analysis of power distribution network and signal traces in high-speed system on package (SoP) = 고속 패키지 내 시스템 (SoP) 에서 전력 분배 연결망과 신호선 사이의 노이즈 간섭 분석link Kim, Jin-Gook; 김진국; et al, 한국과학기술원, 2006 |
| Noise Coupling Effects on CMOS Analog-to-Digital Converter in Magnetic Field Wireless Power Transfer System Using Chip-PCB Comodeling and Simulation Kim, Joung-Ho; Bae, Bumhee; Kim, Jonghoon; Kim, Suk Jin; Kong, Sunkyu, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.57, no.3, pp.329 - 338, 2015-06 |
| Noise coupling emulation between TSV and active circuit through metal oxide patch Kim, Joungho; Jonghyun Cho; Jaemin Lim, 65th Electronic Components and Technology Conference (ECTC), 65th Electronic Components and Technology Conference (ECTC), 2015-05-28 |
| Noise Coupling Modeling and Analysis of Through Glass Via(TGV) Kim, Joungho; Kim, Jihye; Kim, Youngwoo; Cho, Jonghyun; Venky Sundaram; Rao Tummala, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 |
| Noise Coupling of Through-Via in Silicon and Glass Interposer Kim, Joungho; Manho Lee; Jonghyun Cho; Joohee Kim; Jiseong Kim, ECTC Conference, ECTC Conference, 2012-05-29 |
| Noise Coupling of Through-Via in Silicon and Glass Interposer Kim, Joungho; Jonghyun Cho; Joohee Kim; Jiseoung Kim, 63rd Electronic Components and Technology Conference (ECTC), pp.1806 - 1810, ECTC2013, 2013-05-19 |
| Noise coupling to signal trace and via from power/ground simultaneous switching noise in high speed double data rates memory module Park, J.; Kim, H.; Pak, J.S.; Jeong, Y.; Baek, S.; Kim, Joungho; Lee, J.-J.; et al, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.592 - 597, IEEE, 2004-08-09 |
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