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Proposal of TSV-based 3D clock distribution networks and analysis = 관통 실리콘 비아 기반 3차원 클락 분배망에 관한 연구link Kim, Da-Young; 김다영; et al, 한국과학기술원, 2012 |
Timing evaluation of MAC-layer error control on ARM9-based mobile embedded systems Kim, C; Kang, K; Noh, DK; Ryu, J; Ma, JoongSoo, TELECOMMUNICATION SYSTEMS, v.45, pp.329 - 337, 2010-12 |
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