Browse "School of Electrical Engineering(전기및전자공학부)" by Subject wafer level package

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Microwave frequency interconnection line model of a wafer level package

Lee, J; Ryu, W; Kim, Jounghoresearcher; Kim, N; Pak, J; Kim, JM, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, pp.356 - 364, 2002-08

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