Browse "School of Electrical Engineering(전기및전자공학부)" by Subject interposer
Showing results 1 to 7 of 7
| A 3-D Low Jitter and Skew Clock Distribution Network Scheme Using LTCC Package Level Interposer With a Planar Cavity Resonator Lee, Woo-Jin; Kim, Jae-Min; Ryu, Chung-Hyun; Park, Jong-Bae; Kim, Jun-Chul; Kim, Joung-Ho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.19, pp.512 - 514, 2009-08 |
| A Fast and accurate statistical eye-diagram estimation method for high-speed channel including non-linear receiver circuit = 비선형 수신 회로를 포함한 고속 채널에서의 빠르고 정확한 통계 아이다이어그램 예측 기법link Kim, Heegon; 김희곤; et al, 한국과학기술원, 2015 |
| An Efficient Crosstalk-Included Eye-Diagram Estimation Method for High-Speed Interposer Channel on 2.5-D and 3-D IC Choi, Sumin; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Lim, Jaemin; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.927 - 939, 2017-06 |
| Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.940 - 951, 2017-06 |
| Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling Kim, Youngwoo; Cho, Jonghyun; Cho, Kyungjun; Park, Junyong; Kim, Subin; Kim, Dong-Hyun; Park, Gapyeol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1493 - 1505, 2017-09 |
| Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Kim, Kiyeong; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.58, no.6, pp.1747 - 1759, 2016-12 |
| Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Hwang, Insu; Kim, Jihye; Son, Kyungjune; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.5, pp.1562 - 1573, 2021-10 |
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