Browse "School of Electrical Engineering(전기및전자공학부)" by Author Yoon, Euisik

Showing results 16 to 33 of 33

16
High-performance electroplated solenoid-type integrated inductor (SI2) for RF applications using simple 3D surface micromachining technology

Yoon, Jun-Boresearcher; Kim, BK; Han, CH; Yoon, Euisikresearcher; Lee, Kwyroresearcher; Kim, CK, Proceedings of the 1998 IEEE International Electron Devices Meeting, pp.544 - 547, 1998-12-06

17
High-performance three-dimensional on-chip inductors fabricated by novel micromachining technology for RF MMIC

Yoon, Jun-Boresearcher; Han, Chul-Hiresearcher; Yoon, Euisikresearcher; Kim, CK, Proceedings of the 1999 IEEE MTT-S International Microwave Symposium Digest 'The Magic Touch of Microwaves', v.4, pp.1523 - 1526, 1999-06-13

18
In vivo optical modulation of neural signals using monolithically integrated two-dimensional neural probe arrays

Son, Yoojin; Lee, Hyunjoo Jennyresearcher; Kim, Jeongyeon; Shin, Hyogeun; Choi, Nakwon; Lee, C. Justin; Yoon, Eui-Sung; et al, SCIENTIFIC REPORTS, v.5, 2015-10

19
Low Voltage Actuated RF MEMS Switches Using Push-Pull Operation

Yoon, Euisik; Hong, Songcheolresearcher; Hah, D, SSDM 2000, pp.28 - 31, 2000

20
Method for manufacturing a semiconductor device having a metal layer floating over a substrate

Yoon, Jun-Boresearcher; Han, Chul Hi; Yoon, Euisikresearcher; Kim, Choong Ki, 2003-02-11

21
Monolithic high-Q overhang inductors fabricated on silicon and glass substrates

Yoon, Jun-Boresearcher; Han, Chul-Hiresearcher; Yoon, Euisikresearcher; Kim, Choong Ki, 1999 IEEE International Devices Meeting (IEDM), pp.753 - 756, 1999-12-05

22
Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM)

Yoon, Jun-Boresearcher; Han, Chul-Hiresearcher; Yoon, Euisikresearcher; Kim, Choong Ki, Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS, pp.624 - 629, 1999-01-17

23
Multilevel microstructure fabrication using single-step 3D photolithography and single-step electroplating

Yoon, Jun-Boresearcher; Lee, JD; Han, Chul-Hiresearcher; Yoon, Euisikresearcher; Kim, Choong Ki, Proceedings of the 1998 Conference on Materials and Device Characterization in Micromachining, v.3512, pp.358 - 366, 1998-09-21

24
Novel and High-Yield Fabrication of Electroplated 3D Micro-Coils for MEMS and Microelectronics

Yoon, Jun-Boresearcher; Han, Chul-Hiresearcher; Yoon, Euisikresearcher; Kim, Choong Ki, Micromachining and Microfabrication Process Technology IV, v.3511, pp.233 - 240, Micromachining and Microfabrication Process Technology IV, 1998-09-21

25
Novel Fabrication of Electroplated 3D Micro-Coils Using 3D Photolithography of Thick Photoresist

Yoon, Jun-Boresearcher; Han, Chul-Hiresearcher; Yoon, Euisikresearcher; Kim, Choong Ki, International Microprocesses and Nanotechnology Conference, pp.85 - 86, The Korean Institute of Telematics and Electronics, 1998-07

26
Novel monolithic and multilevel integration of high-precision 3-D microfluidic components

Yoon, Jun-Boresearcher; Han, Chul-Hiresearcher; Yoon, Euisikresearcher; Kim, Choong Ki, Proceedings of the SPIE symposium on Micromachining and Microfabrication: Materials and Device Characterization in micromachining, v.3515, pp.183 - 191, 1998-09-21

27
Novel two-step baking process for high-aspect-ratio photolithography with conventional positive thick photoresist

Yoon, Jun-Boresearcher; Han, Chul-Hiresearcher; Yoon, Euisikresearcher; Kim, Choong Ki, Proceedings of the 1998 Conference on Materials and Device Characterization in Micromachining, v.3512, pp.316 - 325, 1998-09-21

28
Phase Noise Improvement in Fully Integrated 5GHz VCOs by Using High Q MEMS Inductors

Park, EC; Song, TS; Baek, SH; Yoon, Jun-Boresearcher; Yoon, Euisikresearcher, 제10회 반도체 학술대회, 2003

29
Planarization and trench filling on severe surface topography with thick photoresist for MEMS

Yoon, Jun-Boresearcher; Oh, G.Y.; Han, Chul-Hiresearcher; Yoon, Euisikresearcher; Kim, Choong Ki, the SPIE symposium on Micromachining and Microfabrication: Materials and Device Characterization in micromachining, v.3511, pp.297 - 306, 1998-09-21

30
Sealed-type remote pressure-monitoring device and method for fabricating the same

Yoon, Jun-Boresearcher; Yoon, Euisikresearcher; Park, Eun-Chul, 2001-09-11

31
Sealed-type remote pressure-monitoring device and method for fabricating the same

Park, Eun-Chul; Yoon, Jun-Boresearcher; Yoon, Euisikresearcher, 2003-02-11

32
Three- dimensional metal devices highly suspended above semiconductor substrate, their circuit model, and method for manufacturing the same

Yoon, Jun-Boresearcher; Yoon, Euisik; Kim, Choong-Ki; Han, Chul-Hi, 2004-06-03

33
Uniform and Simultaneous Fabrication of High-Precision and High-Density Nozzles, Channels, and Cavities for Inkjet Printheads

Yoon, Jun-Boresearcher; Kim, Choong Ki; Yoon, Euisikresearcher; Han, Chul-Hiresearcher, Proceedings of the SPIE symposium on Micromachining and Microfabrication: Materials and Device Characterization in micromachining, v.3511, pp.214 - 224, 1998-09

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