Browse "School of Electrical Engineering(전기및전자공학부)" by Author 1094

Showing results 93 to 152 of 161

93
Low noise THz Emitter Using Lift-off LT-GaAs Thin Film Sitch on Fused Silica

Kim, Joungho; Baek, Seungyong; Lee, Jongjoo; Ryu, Jaeyoung; Jung, Yuchul; Lee, Heeseok, International Terahertz workshop 2000, 2000

94
Measurement of Picosecond Pulse Propagation Characteristics on Coplanar Transmission Lines

Kim, Joungho; Lee, Jongjoo; Yu, S., 5th IEEE Workshop on Signal Propagation on Interconnects, IEEE, 2001

95
Methodology to Generate Frequency Domain Specifications from Eye Masks using Statistical Analysis

Kim, Joungho; Kim, Nam Hoon; Yi, Ju Hwan; Lee, Eric; Sung, Baegin; Hwang, Seung Ho, DesignCon 2007, 2007

96
Microwae Frequency Model and High-density design of Multiple Line Grid Array (MLGA) Package

Kim, Joungho; Ahn, Seungyoung; Lee, Joonwoo; Kim, Jonghoon; Ryu, Woonghwan; Kim, Youngsoo; Choi, Hyun Seok; et al, IMAPS 2000, 2000

97
Microwave Frequency Dielectric Constant and Loss Tangent Measurements of PCB materials Using Stripline Structure

Kim, Joungho; Kim, Jingook; Lee, Junho; Kim, Namhoon; Lee, Junwoo, APACK2001, 2001

98
Microwave Frequency Model of Flip-Chip interconnects using Anisotripic Conductive Film

Kim, Joungho, HDP/MCM conference, 1999

99
Microwave frequency model of water level package and increased loading effect on rambus memory module

Lee, J.; Choi, B.; Ahn, S.; Ryu, W.; Kim, J.M.; Choi, K.S.; Hong, J.-K.; et al, 51st Electronic Components and Technology Conference, pp.128 - 132, 2001-05-29

100
Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer

Yoon, K.; Kim, G.; Lee, W.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.702 - 706, 2009-12-09

101
Modeling and analysis of die-to-die vertical coupling in 3-D IC

Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09

102
Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC

Kim, J.; Pak, J.S.; Cho, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24

103
Modeling and Verification to Analyze Effect of Power/Ground Noises on CMOS Feedback Operational Amplifier

Kim, Joungho; Shim, Yujeong; Park, Jongbae; Shim, Jongjoo, International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2007

104
Modeling of Chip Level Power Distribution Network Based on Segmentation Method

Kim, Joungho; Kim, Jaemin; Shim, Yujeong; Song, Eakhwan; Koo, Kyungchul, International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2007

105
Multi-Chip Module (MCM) RF Transceiver For 1.8 GHz Cellular Phone

Kim, Joungho; Kim, Namhoon; Ryu, Woonghwan; Kim, Jonghoon; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Sungil; et al, APACK99, Symposium on Advances in packaging, pp.440 - 443, 1999-12

106
Multi-Stacking Through-Silicon-Via Effects on Signal Integrity and Power Integrity for Application of 3-Dimensional Stacked-Chip-Package

Kim, Joungho; Pak, Jun So; Ryu, Chunghyun, Presented at XXIX General Assembly of International Union of Radio Science (URSIGA 2008), 2008

107
Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications

Choi, J.; Kam, D.G.; Chung, D.; Srinivasan, K.; Govind, V.; Kim, Joungho; Swaminathan, M., 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, v.2005, pp.69 - 72, IEEE, 2005-10-24

108
Network-on-Chip and Network-in-Package for High-Performance SoC

Kim, Joungho; Lee, Kangmin; Lee, Se-Joong; Kim, Donghyun; Kim, Kwanho; Kim, Gawon; Yoo, Hoi-Jun, IEEE 1st Asian-Solid State Circuits Conference, pp.485 - 488, 2005-11

109
Novel High-impedance photoconductive sampling probe for ultra-high speed circuit characterization

Kim, Joungho; Chan, Y. J.; Williamson, S.; Nees, J.; Wakana, S.; Whitaker, J.; Pavlidis, D., Technical Digest of 1992 IEEE GaAs IC Symposium, pp.19 - 22, 1992

110
Novel time domain picosecond pulse sampling system for non-contact characterization of liquids, semiconductors, and metals

Kim, Woopoung; Ryu, Jaeyoung; Lee, Heeseok; Kim, Joungho, Proceedings of the 1999 Pacific Rim Conference on Lasers and Electro-Optcis (CLEO/PACIFIC Rim '99), v.3, pp.791 - 792, 1999-08-30

111
On-Chip PDN (Power Distribution Network) Comparison between Single Chip and Stacked Multi-Chips with TSV (Through Silicon Via)

Park, Junso; Kim, Joungho, 2009 Korea-Japan Joint Conference, pp.139 - 142, IEEE, 2009-05-14

112
On-Wafer Pump-Probe Photoconductive Sampling for Millimeter Wave Passive Device Testing

Kim, Joungho; Lee, J; Lee, HS, 5th International Workshop on Femtosecond Technology, 1998-02

113
Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls

Ahn, Seung Young; Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Kim, Woo Poung; Paik, Kyung-Wook; et al, Proceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999), pp.421 - 425, 1999-10-18

114
Over Giga Hertz Digital Interconnects Using Anisotropic Conductive Film(ACFs)Flip-Chip

Kim, Joungho, , 1999

115
Overview of Power/Ground Effect on Data Eye and Clock Jitter; from Board Resonance to Substrate Coupling

Chung, Daehyun; Kim, Hyungsoo; Kim, Joungho, IEEE 5th Electronics Packaging Technology Conference, pp.30 - 32, IEEE, 2003-12-12

116
Photoconductive Sampling Using Phase Retrieval algorithm

Kim, Joungho; Kim, WP; Lee, JJ, Inter. Topical Workshop on Contemporary Photonics Technology231, 1998-01

117
Picosecond characteristics of velocity overshoot in GaAs up to 200 kV/cm

Kim, Joungho; Son, J.; Hsa, W.; Norris, T. B.; Whitaker, J. F.; Mourou, G. A., Quantum Electronics and Laser Science conference, pp.152 - 152, 1993

118
Picosecond Detector, Optical Temporal Analyzer, and Free-Standing Circuit Probe

Kim, Joungho; Nees, J.; Williamson, S.; Gupta, S., Ultrafast Electronics and Optoelectronics, pp.186 - 188, 1993-01

119
Picosecond Pulse Propagation Measurement on CPW Using A Photoconductive Near-Field Probe

Kim, Joungho; Lee, Jongjoo, 2th MINT Milimeter-wave International, pp.109 - 112, 2001

120
Picosecond Time-Domain Characterization of Millimeter-Wave Antenna Using Fiber-Coupled Photoconductive Probe Antenna

Kim, Joungho; Lee, Heeseok; Lee, Jongjoo; Kim, Woopoung; Ryu, Jaeyoung, Korea-China Joint Symposium on Semiconductor Physics and device Applications, pp.57 - 59, 1999-09-13

121
Picosecond Time-Domain Photoconductive Sampling Method For Measuring Guided and Free-Space Pulse Propagation

Kim, Joungho; Ryu, Jaeyoung; Lee, Jongjoo; Lee, Heeseok; Kim, Woopoung, 8th Topical Meeting on Electrical Performance of Electronic Packaging, 1999

122
Power/Ground Noise Mitigation Using Z-shape Partial Electromagnetic Bandgap (ZP-EBG) Structure for Ultra-Wideband (UWB) System

Kim, M; Yoon, C; Lee, W; Sung, H; Kim, Joungho, 2010 Asia-Pacific Radio Science Conference, 2010 Asia-Pacific Radio Science Conference, 2010-12-30

123
Precise analysis and modeling of far-end crosstalk and far-end crosstalk saturation using mode analysis in coupled microstrip lines

Kim, G.; Song, E.; Kim, Ji Seong; Kim, Joungho, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02

124
Precise Analysis and Modeling of Far-end Crosstalk using Mode Analysis in Coupled Microstrip Lines

Kim, Joungho; Kim, Gawon; Song, Eakhwan; Kim, Jiseong, Electrical Design Advanced Packaging & Systems, EDAPS 2009, 2009

125
Quarter-Circle Shaped Plane Cavity Resonator for Skew-Free and Low Jitter Clock Distribution Network

Kim, Joungho; Lee, Woojin; Ryu, Chunghyun; Park, Jongbae, Presented at Proceeding of XXIX General Assembly of International Union of Radio Science (URSIGA 2008), 2008

126
Radiated Electromagnetic Interference (EMI) Suppression from Plasma Display Panel by using Filtering Method based on Measurements

Kim, Joungho; Lee, Heejae; Pak, Jun So; Shin, Minchul; Park, Hyunjeong; Shim, Jongjoo; Kim, Gawon; et al, 2009 Korea-Japan Joint Conference, pp.223 - 226, 2009

127
Recent advances in electromagnetic compatibility of 3D-ICS - Part II

Sicard, Etienne; Jianfei, Wu; Shen, Rongjun; Li, Er-Ping; Liu, En-Xiao; Kim, Joungho; Cho, Jeong-Hyeon; et al, IEEE Electromagnetic Compatibility Magazine, v.5, no.1, pp.65 - 74, 2016

128
Reduction of multilayer PCB edge radiation excited by through-hole signal via with De-Cap Fence

Kim, Joungho; Pak, J. S.; Lee, J., 2003 Asia-Pacific Microwave Conference, pp.870 - 873, 2003

129
Reduction of RF-coils Loading Effects on Quadrature Coupler of 3-T MRI using 4-port Network Analysis

Kim, Joungho; Ryu, WH; Sung, MH; Kim, HS; Lee, HK, Sixth Meeting of the Inter. Society for Magnetic Resonance, 1998-04

130
RF Interconnect for Multi-Gbit/sec Board-Level Clock Distribution

Kim, Joungho; Ryu, Woonghwan; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Namhoon; Choi, Baekkyu, 8th Topical Meeting on Electrical Performance of Electronic Packaging, 1999-10

131
RF Phenomena in High-Speed VLSI Interconnections

김정호; 김형수; 류웅환; 김종훈, Semicon Korea, 1998-01

132
Separation of Reflections and Noises from THz measurement Using Independent Component Analysis (ICA)

Kim, Joungho; Jung, Youchul; Ryu, Jaeyoung; Lee, Jongjoo; Baek, Seungyong, International Terahertz workshop 2000, 2000

133
Seperated Role of On-chip and On-PCB Decoupling Capacitors on reduction of radiated Emission on Printed Circuit Board

Kim, Joungho; Kim, Jonghoon; Choi, Baekyu; Kim, Hyungsoo; Ryu, Woonghwan; Yun, Younghwan; Ham, Seog-heon; et al, 2001 IEEE International Symposium on Electromagnetic Compatibility, IEEE, 2001

134
Signal quality test with 3-dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP)

Yoon, C.; Kim, Joungho; Kim, J., 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02

135
Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board

Kim, Joungho; Kim, H.; Jeong, Y.; Lee, J.; Kim, J., 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.23 - 26, 2002-05-12

136
Solution Space Analysis of Interconnects for Low voltage Differencial Signaling(LVDS)Applications

Kim, Joungho; Ahn, S; Lu, A C W.; Fan, W; Wai, L L, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP2001), pp.297 - 330, 2001

137
Spread spectrum clock generator with delay cell array to reduce the EMI from a high-speed digital system

Kim, J.; Kam, D.G.; Kim, Joungho, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.3, pp.820 - 825, IEEE, 2004-08-09

138
Suppression of radiated emission from an 8-bit micro-controller using gate-oxide filtering capacitors

Kim, Hyungsoo; Kim, Jonghoon; Ryu, Woonghwan; Sung, Myunghee; Ahn, Seungyoung; Kim, Joungho, Proceedings of the 1999 IEEE EMC Symposium on 'Electromagnetic Compatibility', v.2, pp.811 - 815, IEEE, 1999-08-02

139
Tapered Slot Shape on Slotted Reference Plane of Multi-layer PCB for Reduction of Crosstalk and Radiated Emission

Kim, Joungho; Kim, Jingook; Kim, Hyungsoo; Jeong, Youchul, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.275 - 278, IEEE, 2002

140
Terahertz Optoelectoonics: Applications using Photoconductive sampling

김정호; 이종주; 이희석; 김우평; 이재훈, '98 Femtosecond Science and Technology Workshop, 1998-02

141
Terahertz Radiation Image from Photoconductive Dipole Antenna

Kim, Joungho; Lee, H; Lee, J, Inter. Topical Works. on Contemporary Photonics Tech., 1998-01

142
Terahertz Technology and applications

Kim, Joungho, International Meeting on Optoelectronics and Photonic Instrumentation, 1999-12

143
The improvement of Signal Integrity (SI) according to the location of via in the vicinity of a slot in the reference plane

Kim, T.H.; Lee, J.; Kim, H.; Jun, P.J.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.185 - 188, IEEE, 2002-05-12

144
Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity

Lee, Manho; Cho, Jonghyun; Pak, Jun So; Lee, Hyungdong; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29

145
Through Silicon Via (TSV) shielding structures

Cho, J.; Kim, Joungho; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25

146
Time-domain Network Analysis of MM-wave Circuits Based on a Photoconductive Probe Sampling technique

Kim, Joungho; Son, J.; Wakana, S.; Nees, J.; Williamson, S.; Whitaker, J.; Kwon, Y.; et al, 1993 IEEE MTT-s Digest, pp.1359 - 1362, 1993

147
Transient Response of Terahertz Emitter using Finite-Difference Time-Domain (FDTD) Method

Kim, Joungho; Lee, Heeseok; Lee, Jaehoon, The Sixth IEEE International Conference on Terahertz Electronics, pp.208 - 210, 1998-09

148
TSV modeling and noise coupling in 3D IC

Kim, Joungho; Cho, J.; Kim, J., 3rd Electronics System Integration Technology Conference, ESTC 2010, ESTC 2010, 2010-09-13

149
Ultrafast Single Mode Pulse Propagation on CPW with Air-bridges Observed by Photoconductive Pump-Probe Measurement

Kim, Joungho; Lee, Jongjoo, SPIE Workshop on Terahertz and Gigahertz Photonics, pp.295 - 302, 1999-07

150
Ultrafast/Terahertz Optoelectronics

Kim, Joungho, , 1997-09

151
Unit Cell Modeling of Interconnect Isolated by Metal-filled Via Array for High Crosstalk Immunity

Kim, Joungho; Lee, Heeseok; Park, Bongcheol; Kam, Dong Gun, IEEE 6th Workshop on Signal Propagation on Interconnects, pp.41 - 43, IEEE, 2002

152
Unit-cell modeling of high-speed interconnect with adjacent metal-filled via array using FDTD method

Lee, Heeseok; Park C.; Kam D.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.41 - 43, IEEE, 2002-05-12

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