Browse "School of Electrical Engineering(전기및전자공학부)" by Author 1094

Showing results 1 to 60 of 161

1
10 GHz Differential Line Modeling of Leadframe-type TQFP Package for High-speed Serial Interconnection Systems

Ahn, Seungyoung; Kim, Tae Hong; Kim, Joungho, IEEE 7th Workshop on Signal Propagation on Interconnects, pp.43 - 46, IEEE, 2003

2
100GHz Time Domain Measurement Using photoconductive Sampling

Kim, Joungho; Lee, J; Lee, H; Lee, J; Kim, W, The Sixth IEEE Inter. Conf. on Terahertz Elec., 1998-09

3
120-G Hz-Bandwidth Characterization of Microwave Passive Devices Using External Silicon-On-Sapphire Photoconductive Sampling Probe

Kim, Joungho; Son, J.; Wakana, S.; Whitaker, J., Ultrafast Electronics and Optoelectronics, pp.224 - 227, 1993

4
3 GHz Wide Frequency Model of Ferrite Bead for Power/Ground Noise Simulation of High-speed PCB

Kim, Joungho; Kim, Tae Hong; Lee, Junho; Kim, Hyungsoo, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.217 - 220, IEEE, 2002

5
3 GHz Wide Frequency Model of Surface Mount Technology (SMT) Ferrite Bead for Power/Ground and I/O Line Noise Simulation of High-speed PCB

Kim, Tae Hong; Kim, Hyungsoo; Pak, Jun So; Kim, Joungho, IEEE 7th Workshop on Signal Propagation on Interconnects, pp.181 - 284, IEEE, 2010-11-15

6
3-Tesla용 고출력 송수신 수위치와 Microstrip Quad-coupler 의 최적화 설계 및 제작

Kim, Joungho; Ryu, Woonghwan; Lee, Heungkyu, MRI학회, MRI학회, 1998

7
32-Back 1Gb DRAM with 1GB/s Bandwidth

Kim, Joungho; Yoo, J. H.; Kim, C. H.; Lim, H. K.; Cho, S. I.; You, S. M.; Lim, H. K., 1996 ISSCC Conference, pp.23 - 23, 1996

8
3D strip meander delay line structure for multilayer LTCC-based SiP applications

Kim, G.; Lu A.C.W.; Wei, F.; Wai, L.L.; Kim, Joungho, 2008 58th Electronic Components and Technology Conference, ECTC, pp.2081 - 2085, 2008-05-27

9
3GHz Through-Hole Signal Via Model Considering PowedGround Plane Resonance Coupling and Via Neck Effect

Pak, Jun So; Kim, Joungho, Electronic Components and Technology Conference, pp.1017 - 1022, 2003-05-27

10
3T MRI 용 spiral Head Coil 개발 및 3 T Birdcage coil 과의 비교 분석

김정호; 박준서; 김종훈; 이종오; 박부식, KSMSM 99, pp.97 -, 1999

11
A 6.4Gbps On-chip Eye Opening Monitor Circuit for Signal Integrity Analysis of High Speed Channel

Kim, Joungho; Shin, Mincheol; Shim, Jongjoo; Kim, Jaemin; Pak, Jun So; Hwang, Chulsoon; Yoon, Changwook; et al, Presented at Proceeding of 2008 IEEE EMC Symposium, pp.1 - 7, 2008-08

12
A chip-package hybrid DLL loop and clock distribution network for low-jitter clock delivery

Chung, D.; Ryu, C.; Kim, H.; Lee, C.; Kim, J.; Kim, J.; Bae, K.; et al, 2005 IEEE International Solid-State Circuits Conference, ISSCC, v.48, pp.514 - 614, 2005-02-06

13
A compact, low-cost, and wide-band passive equalizer design using multi-layer PCB parasitics

Song, E.; Kim, J.; Kim, Joungho; Cho, J., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.165 - 168, IEEE, 2010-10-25

14
A Delay Line Circuit Design For Crosstalk Minimization Using Genetic Algorithm

Kim, Joungho; Chung, Chaeho; Lee, Soobum; Kwak, Byungman; Kim, Gawon, China-Japan-Korea Joint Symposium on Optimization of Structural and Mechanical Systems, pp.551 - 556, 2006

15
A Delay Line Circuit Layout For Crosstalk Minimization Using Genetic Algorithm and Experimental Verification

Kim, Joungho; Chung, Chaeho; Lee, Soobum; Kwak, Byungman; Kim, Gawon, World Congress on Structural and Multidisciplinary Optimization, 2007

16
A dual-slope signaling scheme to suppress electromagnetic interference (EMI) with sustaining eye margin

Yoon, C.; Baek, S.; Lee, H.; Jeong, Y.; Park, J.; Park, H.; Sung, B.; et al, 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008, pp.143 - 146, 2008-10-27

17
A Fast and Efficient Modeling Method for Chip-Package-PCB Hierarchical Power Distribution Network

Kim, Joungho; Kim, Jaemin; Shim, Jongjoo; Pak, JunSo, IEEE Electrical Design of Advanced Packaging and Systems Symposium, 2008

18
A Fast and Precise Analytical Eye-diagram Estimation Method for a Channel of a Pair of Differential Microstriplines on PCB with Arbitrary Terminations

Kim, Joungho; Cho, Jeonghyeon; Song, Eakhwan; Shim, Jongjoo; Shim, Yujeong, Electrical Design Advanced Packaging & Systems, EDAPS 2009, 2009

19
A fast and precise eye-diagram estimation method for a channel of a pair of differential microstrip lines on PCB with arbitrary terminations

Cho, J.; Song, E.; Shim, J.; Shim, Y.; Kim, Joungho, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02

20
A Frequency Clock Distribution Scheme Using Bond-Wire Inductor

Kim, Joungho; Lee, Woojin; Pak, Jun So; Pak, Jiwoo; Ryu, Chunghyun; Park, Jongbae, IEEE Electrical Design of Advanced Packaging and Systems Symposium, 2008

21
A Low-Cost and High-density RF Multi-chip Module Tranceiver For 1.8 GHz Personal Communication Service

Kim, Joungho; Ryu, Woonghwan; Kim, Jonghoon; Kim, Namhoon; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Sungil; et al, IEEE ECTC Conference, IEEE, 2000

22
A MLGA Connector for High speed and High Density

Kim, Joungho; Kim, Young Soo; Choi, Hyung Seok; Ko, Youngwoo; Bang, Hyo Jae; Kim, Woo Kyung; Baek, Seungyong; et al, HD International 2001 (The International Conference and Exhibition on High Density Interconnect and Systems packaging), 2001

23
A New 3.0T Hybrid-Spiral-Birdcage (HSB) Coil for Improved Homigeneity Along Z-Axis

Kim, Joungho; Park, Jun So; Kim, Jonghoon; Lee, Jong-O; Park, Bu-sik; Jung, Seung-Pil; Jung, Kwan-jin, International Society for Magneitc Resonance of Imaging, 2000

24
A New Graduate Packaging Course in Electronics Course in Electronics - High-speed Digital Interconnection and Packaging

Kim, Joungho, 2nd International Academic Conference on Packaging, 1999-03

25
A Noise Coupling Effect on Reference Voltage Level of Triggering Circuit in Non-coherent UWB Communication System

Kim, Joungho; Yoon, Changwook; Shin, Minchul; Shim, Yujeong; Kim, Myunghoi; Cho, Jeonghyeon, EMC Kyoto Symposium, 2009

26
A Novel Free-Standing Absolute-Voltage Probe with 2.3 ps Resolution and 1-Microvolt Sensitivity

Kim, Joungho; Williamson, S.; Nees, J.; Wakana, S., 8th International Conference on Ultrafast Phenomena, pp.496 - 496, 1992

27
A Novel radio Frequency Clocking Scheme for Over GHz Digital Two-Phase Clock Distribution

Kim, Joungho, IMAPS Advanced Technology Workshop on Next Generation IC & Package Design, 1999-07-15

28
A Novel Time domain Picosecond Pulse Sampling System for Non-contact Characterization of Liquids Semiconductors, and Metals

Kim, Joungho; Kim, Woopoung; Ryu, aeyoung; Lee, Heeseok, CLEO/Pacific Rim '99, pp.791 - 792, 1999

29
A Novel Twisted Differential Line for High-speed On-chip Interconnections with Reduced Crosstalk

Kim, Joungho; Kam, Dong Gun; Ahn, Seungyoung; Baek, Seungyong; Park, Bongcheol; Sung, Myunghee, IEEE 4th Electronics Packaging Technology Conference, pp.180 - 183, IEEE, 2002

30
A Novel Twisted Differential Line on PCB: Crosstalk Model and Its Application to High-speed Interconnect Circuit Design

Kim, Joungho; Kam, Dong Gun, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.153 - 156, IEEE, 2002

31
A Precise Analytical Estimation Method of Data-dependent Jitter for High Speed Serial Links with the Consideration of Finite Slew Rate of Input Signal

Cho, Jeonghyeon; Song, Eakhwan; Shim, Jongjoo; Kim, Gawon; Kim, Jiseong; Kim, Joungho, 2009 Korea-Japan Joint Conference, pp.215 - 218, 2009

32
A Wide Range CMOS Adaptive Output Drivers for Customized Control of Signal Rise Time and Power/Ground Noise

Kim, Joungho, IMAPS Advanced Technology Workshop on Next Generation IC & Package Design, 1999-07

33
An estimation method of chip level power distribution network inductance using full wave simulation and segmentation method

Kim, J.; Shim, J.; Lee, W.; Pak, J.S.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.339 - 342, 2008-05-19

34
An evaluation of differential impedance in PCBs using two single-ended probes only

Kam, D.G.; Lee, H.; Ryu, W.; Kim, J.; Park, B.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.169 - 171, IEEE, 2002-05-12

35
An On-Chip Signal Integrity Characterization Scheme for Gbps Data Transmission Channel

Kim, Joungho; Cho, Jeonghyeon; Song, Eakhwan; Lee, Woojin, Presented at XXIX General Assembly of International Union of Radio Science (URSIGA 2008), 2008

36
An On-Chip Spectrum Analyzer for Signal Integrity

Kim, Joungho; Cho, Jeonghyeon; Lee, Woojin; Song, Eakhwan; Shim, Jongjoo; Shin, Minchul; Yoon, Changwook, EMC Kyoto Symposium, 2009

37
An undergraduate class for high-frequency design, fabrication, and measurement

Kim, Joungho; Ahn, S.; Park, B.; Chung, Y., Advances in Electronic Packaging, v.3, pp.1827 - 1830, 2001-07-08

38
Analysis and Modeling of Delay and Crosstalk in Differential Meander Delay Line on Based on A Time Domain Mode Impedances

Kim, Joungho; Kim, Gawon; Kim, Jaemin; Lee, Sangrok, IEEE Electrical Design of Advanced Packaging and Systems Symposium, 2008

39
Analysis of DLL Jitter Affected by Power Supply Noise on Power Distribution Network

Kim, Joungho; Shin, Minchul; Yoon, Changwook; Cho, Jeonghyeon; Shim, Jongjoo; Shim, Yujeong, EMC Kyoto Symposium, 2009

40
Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole

Lee, H.; Hong, Y.-S.; Kam, D.; Kim, Joungho, Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects, pp.31 - 34, 2004-05-09

41
Analysis of power distribution network in TSV-based 3D-IC

Kim, K.; Lee, W.; Kim, J.; Song, T.; Kim, J.; Pak, J.S.; Kim, Joungho; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.177 - 180, IEEE, 2010-10-25

42
Analysis of Power/Ground Network for Mixed Mode Circuits in Multi-layer PCB

Kim, Joungho; Jeong, Y.; Kim, H.; Park, J.; Kim, J, 2003 Asia-Pacific Microwave Conference, 2003

43
Analysis of the effect of digital power ground noise on active balun in UHF RTID SiP

Park, J.; Ryu, C.; Yoon, C.; Koo, K.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.586 - 590, IEEE, 2007-12-12

44
Application of a 3-D Field Solver for On-chip and Package Microstrip Interconnection Design

Kim, Joungho; Ryu, Woonghwan; Lu, Albert; Wai, Chee; Wei, Fan, IEEE EPTC 2000, IEEE, 2000

45
Applications of Terahertz Electronics

Kim, Joungho, 1st Asian Conference on Ultrafast Phenomena, 2000-02-28

46
Applications of Terahertz Optoelectronics

김정호, 대한전자공학회 추계종합학술대회, 대한전자공학회, 1999-11-27

47
Balanced TLM and Coupling Model for Analysis of Power/Ground Resonance, Noise Coupling, and Edge Radiation

Kim, Joungho; Pak, Jun So; Lee, Jongbae; Kim, Hyungsoo; Lee, H.J; Choi, C.S, Electromagnetic Compatibility Conference, pp.505 - 508, 2004

48
Basic Analysis of Signal and Power Integrity of TSV Applications

Pak, Jun So; Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Kim, Joungho, 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012-05-18

49
Causal Transient Simulation of Magnitude Equalized Signal on High-speed Interconnects

Kim, Joungho; Song, Eakhwan; Cho, Jeonghyeon, International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2007

50
Characterization of >100 GHz devices using photoconductive pump and probe measurement

Lee, Jaehoon; Lee, Heeseok; Kim, Woopoung; Lee, Jongjoo; Kim, Joungho, Proceedings of the 1998 11th Annual Meeting IEEE Lasers and Electro-Optics Society, LEOS. Part 2 (of 2), v.1, pp.225 - 226, IEEE, 1998-12-01

51
Chip-Package-Circuit Co-modeling for Analysis of Digital Power and Ground Noise Coupling Effect on CMOS Negative Feedback Operational Amplifier

Kim, Joungho; Shim, Yujeong; Park, Jongbae, EMC compo, 2007

52
Circuital Approach to Evaluate Shielding Effectiveness of Rectangular Enclosures with Apertures on Multiple Sides

Kim, Joungho; Shim, Jongjoo; Kam, Dong Gun; Kwon, Jong-Hwa, International Symposium on Electromagnetic Compatibility (EMC Europe), pp.295 - 300, 2004

53
Compact Terahertz Imaging System Using Near-Field Probe

Kim, Joungho; Ryu, J.; Kim, W.; Lee, H., 7th IEEE International Conference on Terahertz Electronics, pp.81 - 84, 1999-11

54
Compensation of BSD and device input capacitance by using embedded inductor on PCB substrate for 3 Gbps SerDes applications

Ahn, S.; Baek, S.; Lee, J.; Kim, Joungho, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.2, pp.499 - 504, 2004-08-09

55
Construction of integrated simulator for developing head/eye tracking system

Kim, Joungho; Lee, D.-W.; Park, C.G.; Bang, H.-C.; Kim, J.-H.; Cho, S.-Y.; Kim, Y.-I.; et al, 2008 International Conference on Control, Automation and Systems, ICCAS 2008, pp.2485 - 2488, 2008-10-14

56
Data-dependent Jitter using Single Pulse Analysis Method in High-speed Interconnection

Kim, Joungho; Song, Eakhwan; Lee, Junho; Kim, Jingook; Kam, Dong Gun; Ryu, Chunghyun, 7th EPTC 2005, pp.810 - 813, 2005

57
Design Comparison of I/O Port Ground and Power Plane for Enhanced ESD Immunity

Kim, Joungho; Lee, Junho; Kim, Tae Hong; Kim, Hyungsoo; Ryu, Woonghwan; Choi, Jae Chun, EMC Europe 2002 International Symposium on Electromagnetic Compatibility, 2002

58
Design Considerations of Electromagnetic Field from Wireless Power Transfer System for Portable Electronic Devices

Kim, Hongseok; Choi, Chul-Seung; Park, Hyun Ho; Kim, Jonghoon; Chun, Yangbae; Kim, Joungho; Ahn, Seungyoung, 2012 Korea-Japan EMT/EMC/BE Joint Conference, 2012-05-18

59
Design guidelines of spread spectrum clock for suppression of radiation and interference from high-speed interconnection line

Kim, J.; Jun, P.; Byun, J.-G.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.189 - 192, IEEE, 2002-05-12

60
Design of optimum terahertz transient response using finite-difference time-domain (FDTD) method

Lee, Heeseok; Lee, Jongjoo; Kim, Woopoung; Lee, Jaehoon; Kim, Joungho, Proceedings of the 1998 11th Annual Meeting IEEE Lasers and Electro-Optics Society, LEOS. Part 2 (of 2), v.1, pp.221 - 222, IEEE, 1998-12-01

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