Showing results 1 to 2 of 2
Improvement of Adhesion and Microwave Transmission Characteristics of Indium Bump by Silver Coating for Low Temperature Flip-Chip Application Jeon, Duk Young; Chu, KM; Lee, JS; Park, HyoHoon, 2005 GIST/KAIST/Kyoto/Tohoku university joint symposium, pp.13 -, 2005 |
Optimization of low temperature flip-chip bonding for VCSEL arrays for polymeric-waveguide-integrated optical interconnection systems Jeon, Duk Young; Chu, KM; Lee, JS; Rho, BS; Cho, HS; Park, Hyo Hoon, Microoptics Conference, pp.402 - 405, 2003 |
Discover