Browse "School of Electrical Engineering(전기및전자공학부)" by Author 1024

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1
Improvement of Adhesion and Microwave Transmission Characteristics of Indium Bump by Silver Coating for Low Temperature Flip-Chip Application

Jeon, Duk Young; Chu, KM; Lee, JS; Park, HyoHoon, 2005 GIST/KAIST/Kyoto/Tohoku university joint symposium, pp.13 -, 2005

2
Optimization of low temperature flip-chip bonding for VCSEL arrays for polymeric-waveguide-integrated optical interconnection systems

Jeon, Duk Young; Chu, KM; Lee, JS; Rho, BS; Cho, HS; Park, Hyo Hoon, Microoptics Conference, pp.402 - 405, 2003

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