Browse "School of Electrical Engineering(전기및전자공학부)" by Author Sukjin Kim

Showing results 1 to 3 of 3

1

Contactless Wafer-Level TSV Connectivity Testing Method Using Magnetic Coupling

Kim, Jounghoresearcher; Heegon Kim; Sukjin Kim; Changhyun Ch; Daniel H. Jung; Jun So Pak, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10

2

Fault Detection and Isolation of Multiple Defects in Through Silicon Via (TSV) Channel

Kim, Jounghoresearcher; Heegon Kim; Jonghoon J; Sukjin Kim; Hyun-Cheol Bae; Kwang-Seong Cho, IEEE International 3D Systems Integration Conference, IEEE International 3D Systems Integration Conference, 2014-12-01

3

Magnetically-Coupled Current Probing Structure Consisting of TSVs and RDLs in 2.5D and 3D Ics

Kim, Jounghoresearcher; Bumhee Bae; Sukjin Kim; Sunkyu Kong; Heegon Kim; Daniel H. Jung, IEEE International 3D Systems Integration Conference, IEEE International 3D Systems Integration Conference, 2014-12-01

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