Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference
Showing results 18081 to 18100 of 22771
| Three-level LLC SRC for high and wide input voltage applications Lee, Il Oun; Moon, GunWoo, Power Electronics and ECCE Asia (ICPE & ECCE), 2011 IEEE 8th International Conference on, pp.52 - 59, IEEE, 2011-05-30 |
| Three-level space vector PWM in low index modulation region avoiding narrow pulse problem Liu, Hyo L.; Cho, Gyu-Hyeong, Proceedings of the 1993 IEEE 24th Annual Power Electronics Specialist Conference, pp.257 - 262, IEEE, 1993-06-20 |
| Three-level 의사공진형 PWM 컨버터 김재현; 이일운; 김영도; 김재국; 문건우, 2010년도 전력전자학술대회, pp.160 - 161, KIPE, 2010-07 |
| Three-Phase Boost-Converter Based PMIC for Thermal Electric Generator Application Tran-Dinh, Thinh; Pham, Hieu Minh; Vu, Tien-Lam; Pham-Nguyen, Loan; Lee, Sang-Gug, 15th Annual IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2019, pp.205 - 208, Institute of Electrical and Electronics Engineers Inc., 2019-11 |
| Three-Phase Magnetic Field Design for Low EMI and EMF Automated Resonant Wireless Power Transfer Charger for UAV Kim, Joungho; Kim, Hongseok; Jung, Daniel H.; Yoon, Kibum; Cho,Yeonje; Kong, Sunkyu; Kwack, Younghwan, IEEE Wireless Power Transfer Conference 2015, IEEE Wireless Power Transfer Conference 2015, 2015-05-13 |
| Three-Switch Active-Clamp Forward Converter with Low Switch Voltage Stress Park, Ki-Bum; Kim, Chong-Eun; Moon, GunWoo; Youn, Myung-Joong, Applied Power Electronics Conference and Exposition, 2009. APEC 2009. Twenty-Fourth Annual IEEE, pp.1390 - 1396, IEEE, 2009-02-15 |
| Three-Switch Active-Clamp Forward Converter with Low Voltage Stress Park, Ki-Bum; Kim, Chong-Eun; Moon, Gun-Woo; Youn, MyungJoong, 2008년 전력전자학술대회, pp.505 - 507, KIPE, 2008-06-30 |
| Three-switch active-clamp forward converter with reduced voltage stress Park, KB; Kim, CE; Moon, GW; Youn, Myung Joong, IEEE APEC, IEEE, 2010-04 |
| Three-switch LLC resonant converter for high efficiency adapter with universal input voltage Lee, Jeong-Soo; Kim, Chong-Eun; Choi, Jae-Won; Baek, Jae-Il; Yeon, Cheol O; Moon, Gun-Woo, Future Energy Electronics Conference and ECCE Asia (IFEEC 2017 - ECCE Asia), 2017 IEEE 3rd International, IEEE, 2017-06-07 |
| Threshold analysis of a sequential detection scheme with locally optimum test statistic Choi, S.W.; Lee, J.; Kwon, H.; Park, S.R.; Song, Iickho, Fall Confer. Inst. EEK, pp.217 - 220, 대한전자공학회, 2005-11 |
| Threshold based Channel Admission Control in IPTV System Choi, JunKyun, ICOIN 2007, 2007 |
| Threshold Boolean Filters Lee, Yong-Hoon; Lee, K.D., Proc. Canadiam Conf. on Electrical and Computer Eng., 1992-09 |
| threshold current density InGaAs surface-emitting lasers buried by amorphous GaAs Park, HyoHoon; Yoo, BS; Lee, EH; Park, MS; Ahn, BT, International Conference on Solid State Devices and Material 1995s, pp.443 - 445, 1995-08-21 |
| Threshold Detection for Timing Recovery Moon, Jaekyun, International Magnetics Conference, pp.0 - 0, 2000-04-12 |
| Threshold Voltage Shift by Quantum Confinement in Ultra-thin Body Device Choi, Yang-Kyu; Ha, Daewon; King, Tsu-Jae; Hu, Chenming, IEEE, pp.85 - 86, 2001-06 |
| Threshold Voltage Shift Due to the Change of Impurity Type of Polysilicon in Heavily Doped Polysilicon Gate MOSFET Kim, Choong Ki, International Symposium on VLSI Technology,Systems and Applications, pp.170 - 173, 1983 |
| Threshold-based admission control method for multicast environment Jo, S.K.; Guha, D.; Choi, JunKyun; Choi, S.G.; Lee, J.H., 8th International Conference Advanced Communication Technology, ICACT 2006, v.1, pp.55 - 59, 2006-02-20 |
| Through silicon via (TSV) equalizer Kim, Joungho; Song, E.; Cho, J.; Pak, J.S.; Lee, J.; Lee, H.; Kim, J., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.13 - 16, 123, 2009-10-19 |
| Through Silicon Via (TSV) Noise Coupling Effects on RF LC-VCO in 3D IC Kim, Joung-Ho; Lim,Jaemin; Cho,Jonghyun; Lee,Manho; Jung,Danial H; Choi,sumin; Lee,Hyunsuk, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 2014-10-26 |
| Through Silicon Via (TSV) shielding structures Cho, J.; Kim, Joungho; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25 |
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