학위논문(석사) - 한국과학기술원 : 전기및전자공학과, 2013.8, [ vi, 39 p. ]
Through Silicon Via (TSV); 결함 검출; 등가 회로 모델; 3차원 집적 회로; 관통 실리콘 비아; Defect Analysis; 3-dimensional integrated circuit (3D-IC); Equivalent circuit model
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