A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission

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In this paper, a novel on-interposer passive equalizer is proposed for chip-to-chip high-speed data transmission on the silicon-based on-interposer channel. The proposed equalizer uses the parasitic resistance and inductance of the on-interposer shunt metal lines to produce the high-pass filter. This filter enables the proposed equalizer to exhibit wideband channel equalization and low power-consumption. Based on the equivalent-circuit model of the proposed on-interposer passive equalizer, the physical dimensions of the equalizer are optimized for 30-Gb/s serial data transmission. The performance of the proposed equalizer with the optimized dimensions was successfully demonstrated by both frequency-and time-domain measurements at data rates of up to 30 Gb/s. In addition, a compact on-interposer passive equalizer was designed for the wide I/O interposer using the same mechanism. The improved quality of serial data transmission in the equalized wide I/O on-interposer channel was successfully verified by simulations at data rates of up to 10 Gb/s.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2015-01
Language
English
Article Type
Article
Keywords

SILICON

Citation

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.1, pp.28 - 39

ISSN
2156-3950
DOI
10.1109/TCPMT.2014.2364621
URI
http://hdl.handle.net/10203/195322
Appears in Collection
EE-Journal Papers(저널논문)
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