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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Diffusion Bonding of W-25Re Alloys to SiC Substrate using Ti Interlayer

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김동석 / 김도경researcher
Publisher
한국재료학회
Issue Date
2013-11-07
Language
KOR
Citation

2013년 한국재료학회 추계 학술발표대회 및 제 24회 신소재 심포지엄

URI
http://hdl.handle.net/10203/191963
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MS-Conference Papers(학술회의논문)
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