Browse "Dept. of Nuclear and Quantum Engineering(원자력및양자공학과)" by Author Xiaoming Xie

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A comparative study of failure mechanisms of Sn-Ag-Cu assemblies under temperature cycling and board level drop test

Yanghua Xiaresearcher; Xiaoming Xie, International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07, IEEE, 2007-06-26

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