Browse "Dept. of Nuclear and Quantum Engineering(원자력및양자공학과)" by Author 37131
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| Noise Coupling and Shielding in Through-Silicon Via (TSV)-based 3D IC Cho, Jonghyun; Kim, Joohee; Pak, Jun So; Lee, Junho; Lee, Hyungdong; Park, Kunwoo, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011-05-17 |
| TSV mutual inductance effect on impedance of 3D stacked on-chip PDN with multi-TSV connections Pak, Jun So; Cho J.; Kim J.; Lee J.; Lee H.; Park K.; Kim J., 2010 IEEE CPMT Symposium Japan, ICSJ10, 2010-08-24 |
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