Statistical Characteristics of Fatigue Failure of Copper Thin Films

Cited 2 time in webofscience Cited 0 time in scopus
  • Hit : 284
  • Download : 0
Tension-tension fatigue tests were conducted on an electrodeposited copper film with a thickness of 12 mu m under four levels of maximum stress and two levels of mean stress. Statistical characteristics of the measured fatigue lives were analyzed using three estimation methods for cumulative distribution function and five probability distributions in order to identify the dominant probability distribution for the fatigue life of copper film. It was found that while the 3-parameter Weibull distribution provided the best fit for the measured data in most cases, the other distributions also provide a similar coefficient of correlation for the fit. The absence of the dominant probability distribution was discussed with considerations of the deformation mode and the scanning electron microscope (SEM) measurements of fatigue-fractured surfaces. Based on the statistical analysis, the probabilistic stress-life (PSN) curves were obtained for statistical prediction of fatigue life of the copper film in the intermediate life regime.
Publisher
ASME
Issue Date
2013-10
Language
English
Article Type
Article
Keywords

LIFE PREDICTION MODEL; CYCLE FATIGUE; SIZE; FRACTURE; TENSILE; DEFECTS; FOILS

Citation

JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, v.135, no.4

ISSN
0094-4289
DOI
10.1115/1.4025319
URI
http://hdl.handle.net/10203/188523
Appears in Collection
ME-Journal Papers(저널논문)
Files in This Item
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 2 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0