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Wireless Power Distribution Network for 3D Package Using Magnetic Field Resonance

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Kim, Jounghoresearcher / Song, Eunseok / Kim, Hongseok / Song, Chiuk / Kim, Jonghoon J
Publisher
2013 IEEE Electrical Design of Advanced Packaging and Systems
Issue Date
2013-12-13
Language
English
Citation

2013 IEEE Electrical Design of Advanced Packaging and Systems

URI
http://hdl.handle.net/10203/188150
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EE-Conference Papers(학술회의논문)
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