Direct fabrication of copper patterns by reactive inkjet printing

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Reactive inkjet printing (RIP) was applied to fabricate arbitrary copper (Cu) patterns. RIP prints reactive inks which can provide desired materials after the reaction on a substrate. Here, Cu precursors and reducing agents were dissolved together in one solution as a printable ink instead of conventional Cu nanoparticle inks. The prepared reactive ink was applied to the RIP method to provide dot arrays, lines, and films of Cu. The synthesis of Cu was confirmed to occur successfully by thorough analysis. The RIP method can reduce the process cost and resolve critical drawbacks of the conventional inkjet printing such as a nozzle clogging problem. Furthermore, utilizing reactive precursor inks broadens the choice of materials that can be processed by inkjet printing.
Publisher
ELSEVIER SCIENCE BV
Issue Date
2013-11
Language
English
Article Type
Article
Keywords

CONDUCTIVE TRACKS; NANOPARTICLES; SIZE; PARTICLES

Citation

CURRENT APPLIED PHYSICS, v.13, no.9, pp.1870 - 1873

ISSN
1567-1739
DOI
10.1016/j.cap.2013.07.021
URI
http://hdl.handle.net/10203/187363
Appears in Collection
EE-Journal Papers(저널논문)
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