3GHz Through-Hole Signal Via Model Considering PowedGround Plane Resonance Coupling and Via Neck Effect
- Issue Date
- 2003-05-27
- Language
- ENG
- Citation
Electronic Components and Technology Conference, pp.1017 - 1022
- ISSN
- 0569-5503
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
- 2.pdf(461.14 kB)Download
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.