Design of a 3-D SiP for T-DMB with Improvement of Sensitivity and Noise Isolation
- Publisher
- IEEE
- Issue Date
- 2009-01-27
- Language
- ENG
- Citation
IEEE Electronics Packaging Technology Conference, EPTC, pp.1387 - 1392
- Appears in Collection
- NE-Conference Papers(학술회의논문)
- Files in This Item
- [Pub-08.12.09] Design of a 3-D SiP for T-DMB wi...(6.19 MB)Download
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