Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array

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Publisher
IEEE COMPUTER SOC
Issue Date
2006-05
Language
English
Article Type
Article
Citation

IEEE DESIGN & TEST OF COMPUTERS, v.23, pp.212 - 219

ISSN
0740-7475
URI
http://hdl.handle.net/10203/18490
Appears in Collection
EE-Journal Papers(저널논문)
Files in This Item
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