DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ryu, Woonghwan | ko |
dc.contributor.author | Yim, Myung-Jin | ko |
dc.contributor.author | Ahn, Seungyoung | ko |
dc.contributor.author | Lee, Junho | ko |
dc.contributor.author | Kim, Woopoung | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2010-05-19T08:09:41Z | - |
dc.date.available | 2010-05-19T08:09:41Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2000-09 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545 | - |
dc.identifier.issn | 1521-3331 | - |
dc.identifier.uri | http://hdl.handle.net/10203/18484 | - |
dc.description.abstract | This paper firstly reports on the high-frequency SPICE model of the ACF flip-chip interconnections up to 13 GHz. The extraction process Is based on an optimization procedure, called a genetic algorithm, which is known as a robust optimization tool. The proposed equivalent circuit model of the ACF interconnection can readily be used in SPICE circuit simulations for signal integrity analysis of high-frequency packages. Two different ACF interconnections were studied using the Au-coated polymer ball and Ni-filled ball. The extracted models of the two ACFs were found strongly dependent on not only size and rigidity of the conducting balls, but also on their magnetic permeability. | - |
dc.description.sponsorship | IEEE Components, Packaging, and Manufacturing Technology Society | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.title | High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm | - |
dc.type | Article | - |
dc.identifier.wosid | 000089418400018 | - |
dc.identifier.scopusid | 2-s2.0-0034273631 | - |
dc.type.rims | ART | - |
dc.citation.volume | 23 | - |
dc.citation.issue | 3 | - |
dc.citation.beginningpage | 542 | - |
dc.citation.endingpage | 545 | - |
dc.citation.publicationname | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Ahn, Seungyoung | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Ryu, Woonghwan | - |
dc.contributor.nonIdAuthor | Yim, Myung-Jin | - |
dc.contributor.nonIdAuthor | Lee, Junho | - |
dc.contributor.nonIdAuthor | Kim, Woopoung | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | ACF flip-chip interconnection | - |
dc.subject.keywordAuthor | genetic algorithm | - |
dc.subject.keywordAuthor | microwave model | - |
dc.subject.keywordAuthor | resonance | - |
dc.subject.keywordAuthor | SPICE model | - |
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