Deep X-ray mask with integrated electro-thermal micro xy-stage for 3D fabrication

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We present a novel 3D fabrication method utilizing a deep X-ray mask in which an electro-thermal micro xy-stage is integrated. The absorber of the X-ray mask is formed on the shuttle mass of the micro xy-stage and it is oscillated in x- and y-directions during exposures to modify the in-depth dose profile in the resist, usually PMMA. Curved or slanted microstructures are revealed by the modulated dose distribution and the development kinetics of the resist. The nuicro xy-stage is fabricated using a silicon-on-insulator (SOI) wafer, resulting in overhanging, 20 mum thick single-crystal silicon microstructures. It has 20 mum wide, 1 mm long bent-beam electro-thermal actuators along each axis and 10 mum wide, 1 mm long suspension beams supporting a 1.42 mm diameter shuttle mass. Displacements of the shuttle mass in x- and y-directions are both around 20 mum at 742 mW dc input power. Two-dimensional (2D) sinusoidal and tapered microstructures are fabricated through shuttle mass oscillation in two axes during exposures. (C) 2003 Elsevier B.V. All rights reserved.
Publisher
Elsevier Science Sa
Issue Date
2004
Language
ENG
Article Type
Article; Proceedings Paper
Keywords

LITHOGRAPHY (MDXL)-D-2; MICROSTRUCTURES

Citation

SENSORS AND ACTUATORS A-PHYSICAL, v.111, no.1, pp.37 - 43

ISSN
0924-4247
URI
http://hdl.handle.net/10203/1838
Appears in Collection
ME-Journal Papers(저널논문)

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