Bulk-micromachined circular foil type micro heat-flux sensor

A micro heat-flux sensor with high sensitivity under conditions of low heat flux has been designed, bulk-micromachined and tested in a convective environment. The sensor, which is based on the circular foil type heat-flux sensor, is composed of thermal paths and a thermopile. Thermal path layers of electroplated copper on both sides of a wafer are connected through a bulk-micromachined window. A thermopile consisting of a series of n thermocouples is used to get an n-fold output compared to a single couple. When the sensor is placed on a high temperature wall, heat flux from the wall flows through thermal paths and drains out to the environment, producing a temperature difference along these paths. The heat flux is obtained by measuring the temperature difference using a thermopile of Ni-Cr thermocouples. The calibrated sensitivity of the micro heat-flux sensor is 0.17-1.90 mu V/(mW cm(-2)) in the heat flux range 0-180 mW/cm(2). (c) 2005 Elsevier B.V. All rights reserved.
Publisher
ELSEVIER SCIENCE SA
Issue Date
2006-11
Language
ENG
Citation

SENSORS AND ACTUATORS A-PHYSICAL, v.132, no.2, pp.581 - 586

ISSN
0924-4247
DOI
10.1016/j.sna.2003.02.001
URI
http://hdl.handle.net/10203/1833
Appears in Collection
ME-Journal Papers(저널논문)
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