Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference

Showing results 5441 to 5460 of 6424

5441
Thermally Soldered Au Nanogrids with Enhanced Plasmon Quality for Quantitative Multiplexing of Trace-Amount Molecules via SERS

Cho, Seung Hee; Jung, Yeon Sikresearcher, 2019 MRS Spring Meeting and Exhibit, Materials Research Society, 2019-04-23

5442
Thermally Stable Photo-Curable Cyclo-aliphatic Epoxy hybrid Material for White LED Encapsulant

배병수researcher; SeungCheol Yang; Seung-Yeon Kwak; Joon-Soo Kim, 2011년도 추계 고분자학회, 한국고분자학회, 2011-10

5443
Thermally stable Sol-Gel derived siloxane hydrid material for light emitting diode (LED) encapsulation

Bae, Byeong-Sooresearcher; Bae, Junyoung; Kim, Yongho; Kim, Hwea-yoon, 2013 International Sol-Gel Conference, ISGS, 2013-08

5444
Thermally stable transparent sol-gel siloxane hybrid materials for LED encapsulants

Bae, Byeong-Sooresearcher; Kim, J; Yang, S, The International Chemical Congress of Pacific Basin Societies, PACIFICHEM 2010, 2010-12

5445
Thermo-Calc를 이용한 슈퍼 듀플렉스 스테인리스강의 상평형 계산

박상희; 박중근researcher, 대한금속재료학회, 추계학술발표대회, v.38, 대한금속재료학회, 2000

5446
Thermo-compression bonding using Non-Conductive Films (NCFs) for 3-D TSV Micro-bump Interconnection

Lee. Hyeong Gi; Lee, Se Yong; Choi, Yong Won; Paik, Kyung Wookresearcher, IEEE 66th Electronic Components and Technology Conference, IEEE 66th Electronic Components and Technology Conference, 2016-06-01

5447
Thermo-Mechanical Reliability of the Benzocyclobutane(BCB) film in a WLCSP Process

Yu, Jinresearcher; Lee, KO; Kim, JY; Park, IS, Proc.3rd Electronic Materials and Packaging, pp.84 - 87, 2001

5448
Thermo-Mechanical Stress Analysis of Lamination Based MCM-D Substrate

백경욱researcher, 제6회 한국반도체 학술대회, pp.269 - 272, 한국반도체 학술대회, 1999-02-01

5449
Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates

Paik, Kyung-Wookresearcher; Kim, JS; Oh, SH; Seo, HS, International Conference and Exhibition on Multichip Modules and High Density Packaging, pp.449 - 453, 1998-04-01

5450
Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates

Paik, KWresearcher; Kim, JS; Oh, SH; Seo, HS, 제5회 한국반도체 학술대회, pp.587 - 588, 한국반도체 학술대회, 1998-02-01

5451
Thermo-Mechanical Stresses in Lamination Based Si Monolithic MCM-D Substrates

Paik, Kyung-Wookresearcher, Materials Research Society Spring Meeting, pp.192 - 192, 1998-05-01

5452
Thermo-Optic Characteristics and Applications of the Sol-Gel Hybrid Material Films

Bae, Byeong-Sooresearcher, The 5th International Meeting of Pacific Rim Ceramic Societies, 2003

5453
Thermo-Wetting Embossing Nano Imprinting (TENI) Process of HYBRIMERs for Sub-Micron Scale Structure Fabrication

Bae, Byeong-Sooresearcher; W.S. Kim; K.H. Nam; K.B. Yoon, ISNM 2004, 2004

5454
Thermoacoustic Loudspeaker Using N-doped Reduced Graphene Oxide Aerogel

김충선; 이경은; 김상욱; 최정우; 조병진, The 3rd Korean Graphene Symposium, 한국그래핀연구회, 2016-04-15

5455
Thermochemical Production of Sodium Borohydride from Sodium Metaborate in a Scaled-up Reactor

Cho, Eun-Aeresearcher; Eom, K.S.; Kim, M.J.; Oh, S.K.; Nam, SW.; Kwon, HS., International Conference on Hydrogen Production, International Conference on Hydrogen Production, 2012-06-24

5456
Thermochemical stability of IrO2 bottom electrodes in direct liquid injection metalorganic chemical vapor deposition of Pb(Zr,Ti)O3 films

Lee, Won-Jongresearcher; Byun, KM; Kim, YH, 8th Conference of the European Ceramic Society, pp.8 - 8, 2003

5457
Thermochemical stability of IrO2 electrodes in direct liquid injection metalorganic chemical vapor deposition of Pb-based ferroelectric films

이원종researcher, 대한금속재료학회 추계학술발표대회, pp.66 - 66, 2002-10-01

5458
Thermodynamic alloy design of lead-free solders and thermodynamic issues of lead-free soldering in electronic packaging

Jeong, SW; Kim, JH; Lee, Hyuck Moresearcher, 58th Congresso Anual da ABM (Associacao Brasileira de Metalurgia e Materiais), pp.842 - 849, 2003-07-21

5459
Thermodynamic Analysis of the Microstructural Change in Sn-rich Solders affected by their Interfacial Reaction with Cu or Ni(P) UBM

Lee, Hyuck Moresearcher, 38th CALPHAD, 2009-05-17

5460
Thermodynamic and Kinetic Approaches to Lithium Intercalation into Sol-gel Derived Li1-dMn2O4 Electrode

변수일, 한국전기화학회 1999년도 제3회 총회 및 추계학술발표회, pp.64 - 64, 1999

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