Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference

Showing results 5401 to 5420 of 6424

5401
The Use of Na-BETA-Alumina/NASICON Sodium Bielectrolyte in CO2 Sensor

Hong H.S.; Park, Chong-Ookresearcher; Kim J.W., 207th Meeting of the Electrochemical Society, pp.1772 -, 2005-05-15

5402
The ways travelled and the ways to go in sintering, the key technology of ceramic fabrication

Kang, Suk-Joong Lresearcher, 41st Inter. Conference and Expo. On Advanced Ceramics (ICACC2017), American Ceramic Society, 2017-01-23

5403
The α/β Transformation in Si3N4-Nd2O3-Al2O3

Kang, Suk-Joong Lresearcher, 7th SIMCER, pp.14 - 16, 1988-12-01

5404
Theoretical Analysis of the Effect of the Surface Roughness on Lithium Transport through Fractal Li1- CoO2 Film Electrode

변수일, The Korean Electrochemical Society, pp.55 - 55, 2004

5405
Theoretical Anaysis of Final-Stage Liquid-Phase Sintering

Kang, Suk-Joong Lresearcher, Sintering Technology, pp.221 - 228, 1996-01-01

5406
Theoretical Approach to Effect of Surface Roughness on Lithium Transport through Fractal Li1- CoO2 Film Electrode for Lithium Secondary Battery: Numerical Analysis of Generalised Diffusion Equation

Pyun, Su Il, 12th International Meeting on Lithium Batteries, 2004

5407
Theoretical Approach to Faradaic Admittance of Hydrogen Absorption Reaction on Metal Membrane Electrode

변수일, Korean Corros. Sci. Soc., pp.13 - 13, 1993

5408
Theoretical calculation of near-edge x-ray-absorption fine structure of LiMO2 (M=Co, Ni) cathode materials using model cluster

No, Kwangsooresearcher; Jeon, Young-Ah; Kim, Yang-Soo; Kim, Sung-Kwan, The 56th Annual Meeting of International Society of Electrochemistry, v.0, no.0, pp.0 - 0, Annual Meeting of International Society of Electrochemistry, 2005-09-01

5409
Theoretical calculation of near-edge x-ray-absorption fine structure of LiMO2 cathode materials using model clusters

No, Kwangsooresearcher; Jeon, YA; Kim, YS; Kim, SK, International conference on solid state ionics (SSI-15), v.0, no.0, pp.0 - 0, International conference on solid state ionics (SSI-15), 2005-07-19

5410
Theoretical prediction and experimental measurement of the degree-of-cure of Anisotropic Conductive Film (ACF) for Chip-On-Flex (COF) applications

Chung, CK; Kwon, YM; Kim, I; Son, HY; Choo, KS; Kim, SJ; Paik, Kyung-Wookresearcher, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19

5411
Theoretical Prediction of Surface Evolution in Atomic Layer Deposition

강상원researcher, 제 12회 반도체학술대회, pp.PB41 -, 2004

5412
Theoretical study of lithium intercalation in titanium sulfides and titanium oxides

No, Kwangsooresearcher; Kim, Hee Jin; Kim, Yang Soo; Jeon, Young Ah, International Conference on Electroceramics 2005 (ICE2005), v.0, no.0, pp.0 - 0, International Conference on Electroceramics 2005 (ICE2005), 2005-06-14

5413
Theories and Application of Superplasticity

홍순형researcher; Kum, DW, 1st Conference on Mechanical Behaviors, pp.221 - 232, 1987

5414
Thermal analysis of spray forming by reciprocating spray nozzle

Zin-Hyoung Leeresearcher, Proc. 1st International Symposium on Advanced Solidification Processing, pp.283 - 303, 1993

5415
Thermal Analysis of Trapped Hydrogen in AISI 4330 Steel

Lee, Jai Young, Current Solutions to Hydrogen Problems in Steels, pp.423 -, 1982

5416
Thermal and Electrical Conductivity of AlN Ceramics with Low Temperature Sintering

Lee, Ji-Seok; Lee, Hyeon-Keun; Kim, Do Kyungresearcher, 35th International Conference and Exposition on Advanced Ceramics and Composites, The American Ceramic Society, The American Cermic Society's Engineering Ceramics Division, 2011-01-23

5417
Thermal and Mechanical Properties of Epoxy-Graphene Composites by Using Non-covalent Functionalization

Jeon, Seokwooresearcher; Sungho, Song, RPRG, Institute of Physics (IOP), Chinese Academy of Sciences (CAS), Beijing National Laboratory for Condensed Matter Physics (BNLCP), 2012-11-06

5418
Thermal and Mechanical Properties of W/Cu Nanocomposite for Heat Sink Application

Hong, Soon-Hyungresearcher, pp.0 - 0, 2002-06-01

5419
Thermal behavior of Sn nanowires for nano-interconnection

Shin, H; Song, J; Yu, Jinresearcher, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19

5420
Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique

Lee, WS; Han, Y; Yu, Jinresearcher; Kim, SJ; Lee, TY, 6th Electronics Packaging Technology Conference, EPTC 2004, pp.47 - 52, 2005-12-08

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