Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference

Showing results 3801 to 3820 of 7308

3801
Long-range Stripe Nanodomains in Epitaxial BiFeO3 Thin Films on (100) NdGaO3

HONG, DANIEL SEUNGBUM, The International Meeting on Ferroelectricity (IMF-2017), University of Texas at San Antonio, 2017-09-06

3802
Long-term Oxidation Properties of Al-Ti-Cr Two-Phase Alloys as Coating Materials for TiAl Alloy

Wee, Dang-Moon, pp.927 - 930, 2001-01-01

3803
Lost foam casting of Al-alloys

Zin-Hyoung Lee, Proceedings of the 8th Asian Foundry Congress, pp.744 - 753, 2003

3804
Low Cost, Scalable Nanoengineering by Directed Molecular Assembly

Kim, Sang Ouk, International Conference on NanoScience and nanoTechnology (ICNST 2010), 2010-11-08

3805
Low Current Switching Induced by Large Spin Orbit Torque of Tungsten

백승헌; 박경웅; 박병국, 제23회 한국반도체학술대회, 한국물리학회, 한국재료학회, 2016-02-24

3806
Low Defect Preparation Methods of Graphene

Jeon, Seokwoo, 8th Pacific Rim International Congress on Advanced Materials and Processing (PRICM-8), The Minerals, Metals & Materials Society (TMS), 2013-08-06

3807
Low Dielectric Hybrid Inorganic-Organic Mesoporous Silicate Thin Films

Bae, Byeong-Soo; Jung, JI; Bae, JY, XII International Workshop on Sol-Gel Science & Technology, 2003

3808
Low Dielectric Hybrid Inorganic-Organic Mesoporous Silicate Thin Films

배병수; 정지인; 배재영, 한국재료학회 춘계학술대회, 한국재료학회, 2003

3809
Low Dk/Df Siloxane Hybrid Material for High Performance Copper Clad Laminates of 5G Communication Devices

강승모; 엄병조; 장준호; 이현환; 배병수, 2022 한국세라믹학회 춘계학술대회, 한국세라믹학회, 2022-04-13

3810
Low Dk/Df Siloxane Hybrid Polymer for High Performance Copper Clad Laminates of 5G Communication Devices

강승모; 엄병조; 장준호; 이현환; 배병수, 2021 한국고분자학회 추계학술대회, 한국고분자학회, 2021-10-21

3811
Low power Flexible phase change memory through block copolymer self-assembly

Mun, Beomho; You, Byoung Kuk; Yang, Seryeon; Yoo, Hyeon Gyun; Kim, Taejin; Byun, Myeonghwan; Lee, Keon Jae, 2016년도 한국재료학회 추계학술대회, 사단법인 한국재료학회, 2016-11-18

3812
Low resistance and Low temperature Bonding between Silver and Indium

유진; Cho, SI; Kim, YH, 2nd Int. Meeting on Information Display, pp.275 - 278, 2002

3813
Low temperature and ultra fine pitch joints using non-conductive adhesive for flip chip technology

Kim, SY; Oh, TS; Lee, Won-Jong; Kim, YH, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, 2006-08-26

3814
Low temperature annealed solution-processed oxide thin film transistor

Bae, Byeong-Soo; S. Seo; Y. Hwang; J.Jeon, The International Chemical Congress of Pacific Basin Societies, PACIFICHEM 2010, 2010-12

3815
Low temperature burnable CNT paste component for CNT-Field Emitter backlight unit

Lee, S; Jeon, Duk Young, Technical Digest of the 17th International Vacuum Nanoelectronics Conference, IVNC 2004, pp.124 - 125, 2004-07-11

3816
Low Temperature Camera Module Assembly Using Acrylic-based Solder ACFs with Ultrasonic-Assisted Thermo-Compression Bonding Method

Kim, Yoo-Sun; Kim, Seung-Ho; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.1613 - 1616, The 63rd Electronic Components and Technology Conference, 2013-05-29

3817
Low Temperature Curable Anisotropic Conductive Films (ACFs) with Photo-active Curing Agent (PA-ACFs)

Kim, Il; Paik, Kyung-Wook, The 62nd Electronic Components and Technology Conference, IEEE, 2012-05

3818
Low temperature curable Sol-Gel based epoxy siloxane hybrid materials for led encapsulant

Bae, Byeong-Soo; Kim, Hwea-yoon; Bae, Jun Young; Kim, YongHo, 2013 International Sol-Gel Conference, ISGS, 2013-08

3819
Low Temperature Fabrication of Aqueous Solution Processed Flexible Indium Oxide Transparent Thin-Film Transistors on a Plastic Substra

Bae, Byeong-Soo; Hwang, Young Hwan; Seo, Jin-Suk; Nam, Yun Yong; Ryu, Min Ki; Park, Sang-Hee Ko, 2012 International Meeting on Information Display, IMID, 2012-08

3820
Low Temperature Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Sn58Bi Solder Anisotropic Conductive Films (ACFs) and Ultrasonic Bonding Method

Kim, Tae Wan; Suk, Kyung-Lim; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.461 - 467, The 63rd Electronic Components and Technology Conference, 2013-05-29

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