Showing results 2441 to 2460 of 7308
Fabrication and Characterization of 3D structure field emitter using carbon nanotube Hong, Soon-Hyung, NANO KOREA 2010, pp.48 - 48, 2009-08-27 |
Fabrication and Characterization of 3D Structure Field Emitter using Carbon Nanotube Hong, Soon-Hyung, The 10th International Symposium on Nanocomposites and Nanoporous Materials, pp.103 - 103, 2009-12-04 |
Fabrication and Characterization of Al Matrix Composites Reinforced with 3-D Orthogonal Carbon Textile Preforms Hong, Soon Hyung, pp.188 - 190, 복합재료학회, 2002-01-01 |
Fabrication and characterization of Al0.1CrNbVMo high entropy alloy with powder metallurgical process 강병철; 홍순형; 이준호; 류호진, 한국분말야금학회 2017 추계학술대회, 한국분말야금학희, 2017-11-02 |
Fabrication and Characterization of BaxSr1-xTiO3/YBa2Cu3Ox/STO Structure 노광수; 최종완; 김은아; 박순연; 김유진, 한국요업학회 춘계학술발표대회, 한국요업학회, 1999-01-01 |
Fabrication and Characterization of Bragg-diffraction Type Acousto-optic Device using Piezoelectric Thin Films 노광수; 이창호, 한국요업학회 추계학술대회, 한국요업학회, 2001-01-01 |
Fabrication and Characterization of Carbon Nanotube Nanocomposites for Polymer Photovoltaic Cell Applications 진성환; 전광훈; 전석우; 홍순형, Conference on Electronic Materials & Nanotechnology for Green Environment, pp.67 - 67, Conference on Electronic Materials & Nanotechnology for Green Environment, 2011-10-28 |
Fabrication and Characterization of Carbon Nanotube Reinforced Cu Nanocomposites by Electroless Deposition Process Hong, Soon-Hyung, Korean Powder Metallurgy Institute, pp.40 - 40, 분말야금학회, 2008-04-11 |
Fabrication and Characterization of Carbon Nanotube/Ceramic Nanocomposite Powders Hong, Soon-Hyung; Arshad, SN; Cha, SI; Kim, KT, International Symposium on Powder Materials and Processing, pp.61 -, 2004 |
Fabrication and Characterization of Carbon Nanotube/Cu Nanocomposites by Molecular Level Mixing Process Hong, Soon Hyung, Spring Meeting of The Korean Society for Composite Materials, 복합재료학회, 2005-04-29 |
Fabrication and characterization of CaRuO3 electrodes for Pt/BaTiO3/CaRuO3/Si heterostructure No, Kwangsoo; Paik, Han Jong; Hong, Jong In; Jeon, Young Ah; Kim, Yun Seok; Kim, Young Ha, 21th international Korea-Japan seminar on ceramics, v.0, no.0, pp.0 - 0, 2004-11-05 |
Fabrication and characterization of ceramic sheet for the honeycomb by paper making method No, Kwangsoo, PACRIM3, PACRIM, 1998-01-01 |
Fabrication and Characterization of CNT/Al2O3 Nanocomposites by CVD Process 이빈; 구민영; 홍순형, 추계분말야금학회, pp.200 - 200, 추계분말야금학회, 2011-11-01 |
Fabrication and Characterization of CNT/Co Nanocomposite Field Emitters Hong, Soon-Hyung, Fall Meeting of Materials Research Society of Korea, 한국재료학회, 2006-11-03 |
Fabrication and Characterization of CNT/NiO NanocomPosite Powders Hong, Soon-Hyung, Fall Meeting of The Korean Institute of Metals and Materials, 금속재료학회, 2006-10-26 |
Fabrication and characterization of Conductive Films on Biaxial Ni Tapes for Superconductor Applications No, Kwangsoo, Korea-Japan Joint Workshop 2002 on Applied Superconductivity and Cryogenics, 2002-01-01 |
Fabrication and characterization of CuInS2-ZnS core-shell quantum dot/polymer composite Jeon, Duk Young, Joint Smposium on Materials Science and Engineering for the 21st Century, Joint Symposium on the Materials Science and Engineering for the 21st Century, 2010-06-28 |
Fabrication and characterization of embedded capacitors in printed circuit boards using B-stage epoxy/BaTiO3 composite embedded capacitor films (ECFs) Lee, S; Hyun, JG; Pak, JS; Lee, H; Jeon, HS; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.742 - 746, 2008-05-27 |
Fabrication and Characterization of Epoxy Molding Films (EMFs) for Wafer-Level and Panel-Level Fan Out Packages Park, Jong-Ho; Lee, Hanmin; Lee, Seyong; Kyung, Youjin; Kim, Jung Hak; Lee, Kwangjoo; Paik, Kyung-Wook, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.712 - 717, IEEE-CPMT, 2018-05-31 |
Fabrication and characterization of epoxy/bari0 composite embedded capacitor for high frequency behaviors Hyun, JG; Paik, Kyung-Wook; Pak, JS, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.124 - 128, 2008-10-22 |
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