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Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection Sohn, YC; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.20, no.8, pp.1931 - 1934, 2005-08 |
Effect of phosphorous content on phase transformation induced stress in Sn/Ni(P) thin films Song, JY; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.21, no.9, pp.2261 - 2269, 2006-09 |
Study of the reaction mechanism between electroless Ni-P and Sn and its effect on the crystallization of Ni-P Sohn, YC; Yu, Jin; Kang, SK; Choi, WK; Shih, DY, JOURNAL OF MATERIALS RESEARCH, v.18, no.1, pp.4 - 7, 2003-01 |
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