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Effects of metal stacks and patterned metal profiles on the electromigration characteristics in super-thin AlCu interconnects for sub-0.13 mu m technology Lee, Min-Hyung; Kwon, Yong-Min; Pyo, Sung-Gyu; Lee, Han-Choon; Han, Jae-Won; Paik, Kyung-Wook, THIN SOLID FILMS, v.519, no.11, pp.3906 - 3913, 2011-03 |
Intrinsic and extrinsic Gilbert damping in exchange-biased IrMn/Cu/CoFe trilayer films Song, Hyon-Seok; Lee, Kyeong-Dong; You, Chun-Yeol; Yang, See-Hun; Parkin, Stuart; Park, Byong Guk; Sohn, Jeongwoo; et al, APPLIED PHYSICS EXPRESS, v.8, no.5, 2015-05 |
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