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Showing results 1 to 5 of 5

1
High Power and High Reliability Flex-On-Board Assembly Using Solder Anisotropic Conductive Films Combined with Ultrasonic Bonding Technique

Lee, Ki-Won; Saarinen, Ilkka J.; Pykari, Lasse; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.12, pp.1901 - 1907, 2011-12

2
Synthesis of La-doped CaTiO3 perovskite powders from the mixture of metal salt solutions by ultrasonic mist combustion/pyrolysis processes

Jung, CH; Kim, Do Kyung, JOURNAL OF MATERIALS SYNTHESIS AND PROCESSING, v.10, no.1, pp.23 - 29, 2002-01

3
Ultrasonic Bonding of Anisotropic Conductive Films Containing Ultrafine Solder Balls for High-Power and High-Reliability Flex-On-Board Assembly

Kim, Won-Chul; Lee, Ki-Won; Saarinen, Ilkka J.; Pykari, Lasse; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.884 - 889, 2012-05

4
Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection

Lee, Ki-Won; Kim, Hyoung-Joon; Yim, Myung-Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, no.4, pp.241 - 247, 2009-10

5
연성 기판-유기 경성 기판간의 상온 초음파 ACF 접합 공정에 관한 연구 = Ultrasonic anisotropic conductive films (ACFs) bonding of flexible substrates on organic rigid boards at room temperaturelink

이기원; Lee, Ki-Won; et al, 한국과학기술원, 2007

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