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(A) study on the ultra fine pitch Chip-On-Plastic (COP) packaging using nanofiber Anisotropic Conductive Films (ACFs) = 나노파이버 이방성 전도필름을 이용한 초 미세피치 Chip-On-Plastic 패키징에 대한 연구link Lee, Jung Sik; Paik, Kyoung Wook; et al, 한국과학기술원, 2017 |
Effects of Polymer Ball Size and Polyvinylidene Fluoride Nanofiber on the Ball Capture Rate for 100-mu m-Pitch Flex-on-Flex Assembly Using Anisotropic Conductive Films and Ultrasonic Bonding Method Park, Jae-Hyeong; Kim, Tae Wan; Zhang, Shuye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.7, pp.1127 - 1134, 2016-07 |
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