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A Study on the Flexible Chip-on-Fabric Assemblies Using Anisotropic Conductive Films and Metal-Laminated Fabric Substrates Jung, Seung-Yoon; Lee, Tae-Ik; Cho, Minsun; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.360 - 367, 2020-03 |
A Study on ultra-thin chip-in-flex (CIF) package using anisotropic conductive films (ACFs) for wearable electronics applications = 이방성 전도 필름과 박형 칩을 사용한 플렉서블 패키지에 대한 연구link Kim, Jihye; 김지혜; et al, 한국과학기술원, 2015 |
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