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A study on the adhesion enhancement of polyetherimide to Si wafer using an Al-chelate treatment during multichip module fabrication Ko, HS; Chung, IS; Paik, Kyung-Wook, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY , v.83, no.1-3, pp.111 - 118, 2001-06 |
Flexible 3D Electrodes of Free-Standing TiN Nanotube Arrays Grown by Atomic Layer Deposition with a Ti Interlayer as an Adhesion Promoter Yun, Seokjung; Kim, Sang-Joon; Youn, Jaesung; Kim, Hoon; Ryu, Jeongjae; Bae, Changdeuck; No, Kwangsoo; et al, NANOMATERIALS, v.10, no.3, pp.409, 2020-03 |
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