Showing results 1 to 4 of 4
An angular distribution function for the sputter-depositing atoms and general equations describing the initial thickness profile of a thin film deposited inside a via and trench by sputtering Kim, Chang-Gyu; Lee, Won-Jong, THIN SOLID FILMS, v.519, no.1, pp.74 - 80, 2010-10 |
Quantitative study on the enhancement of sidewall coverage of sputter-deposited film by partially tapering the sidewall of via holes Kim, Chang-Gyu; Lee, Won-Jong, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, v.29, no.2, pp.020604-1 - 020604-6, 2011-03 |
Ru 전구체의 열분해 메카니즘과 Ru 박막의 화학기상 증착 = Thermal decomposition mechanism of Ru precursor and chemical vapor deposition of Ru filmslink 최종완; Choi, Jong-Wan; et al, 한국과학기술원, 2004 |
Three-dimensional deposition topography simulation based on new combinations of flux distribution and surface representation algorithms Kwon, Ui-Hui; Lee, Won-Jong, THIN SOLID FILMS, v.445, no.1, pp.80 - 89, 2003-11 |
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