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A thermodynamic study of phase equilibria in the Au-Sb-Sn solder system Kim, JH; Jeong, SW; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.6, pp.557 - 563, 2002 |
Thermodynamic Prediction of Interface Reaction Phases at Cu/Solder Joints Lee, HyuckMo; Yoon, Seung Wook; Lee, Byeong-Joo, JOURNAL OF ELECTRONIC MATERIALS, v.27, no.11, pp.1161 - 1166, 1998 |
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