Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject BUMP

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Demonstration and characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag combination solder for 3-D multistack packaging

Jo, Yun-Hwan; Lee, Joo-Won; Seo, Sun-Kyoung; Lee, Hyuck-Moresearcher; Han, Hun; Lee, Dong-Chun, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.1, pp.110 - 117, 2008-01

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